Inventor · disambiguated record
Imad Yousif
Also filed as: YOUSIF IMAD
29 granted patents·23 pending applications·314 citations·filing 1996–2024
96Inventor score
Top patents by PatentIndex Score
52 records- 0197US8988848B2Extended and independent RF powered cathode substrate for extreme edge tunabilityAPPLIED MATERIALS INC·Filed 2012·Granted Mar 24, 2015·47 cites·16 claims
- 0294US11728141B2Gas hub for plasma reactorAPPLIED MATERIALS INC·Filed 2022·Granted Aug 15, 2023·2 cites·8 claims
- 0394US10204805B2Thin heated substrate supportAPPLIED MATERIALS INC·Filed 2016·Granted Feb 12, 2019·10 cites·19 claims
- 0494US8092605B2Magnetic confinement of a plasmaSHANNON STEVEN C·Filed 2006·Granted Jan 10, 2012·37 cites·22 claims
- 0593US11393710B2Wafer edge ring lifting solutionAPPLIED MATERIALS INC·Filed 2017·Granted Jul 19, 2022·9 cites·15 claims
- 0691US12094752B2Wafer edge ring lifting solutionAPPLIED MATERIALS INC·Filed 2022·Granted Sep 17, 2024·1 cites·10 claims
- 0791US10163606B2Plasma reactor with highly symmetrical four-fold gas injectionAPPLIED MATERIALS INC·Filed 2014·Granted Dec 25, 2018·11 cites·20 claims
- 0890US10008368B2Multi-zone gas injection assembly with azimuthal and radial distribution controlAPPLIED MATERIALS INC·Filed 2014·Granted Jun 26, 2018·10 cites·27 claims
- 0990US7967996B2Process for wafer backside polymer removal and wafer front side photoresist removalAPPLIED MATERIALS INC·Filed 2007·Granted Jun 28, 2011·16 cites·20 claims
- 1090US6366346B1Method and apparatus for optical detection of effluent compositionAPPLIED MATERIALS INC·Filed 1998·Granted Apr 2, 2002·89 cites·34 claims
- 1189US10090181B2Method and apparatus for substrate transfer and radical confinementLEE JARED AHMAD·Filed 2012·Granted Oct 2, 2018·9 cites·15 claims
- 1289US7879183B2Apparatus and method for front side protection during backside cleaningAPPLIED MATERIALS INC·Filed 2008·Granted Feb 1, 2011·13 cites·25 claims
- 1386US8329593B2Method and apparatus for removing polymer from the wafer backside and edgeYOUSIF IMAD·Filed 2007·Granted Dec 11, 2012·14 cites·17 claims
- 1485US11244811B2Plasma reactor with highly symmetrical four-fold gas injectionAPPLIED MATERIALS INC·Filed 2018·Granted Feb 8, 2022·1 cites·7 claims
- 1584US7552736B2Process for wafer backside polymer removal with a ring of plasma under the waferAPPLIED MATERIALS INC·Filed 2007·Granted Jun 30, 2009·9 cites·10 claims
- 1681US11139150B2Nozzle for multi-zone gas injection assemblyAPPLIED MATERIALS INC·Filed 2019·Granted Oct 5, 2021·2 cites·3 claims
- 1780US8414736B2Plasma reactor with tiltable overhead RF inductive sourceCOLLINS KENNETH S·Filed 2010·Granted Apr 9, 2013·4 cites·11 claims
- 1876US2024429088A1Wafer edge ring lifting solutionAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1975US9947559B2Thermal management of edge ring in semiconductor processingAPPLIED MATERIALS INC·Filed 2012·Granted Apr 17, 2018·3 cites·18 claims
- 2074US10825708B2Process kit components for use with an extended and independent RF powered cathode substrate for extreme edge tunabilityAPPLIED MATERIALS INC·Filed 2012·Granted Nov 3, 2020·2 cites·16 claims
- 2174US10410841B2Side gas injection kit for multi-zone gas injection assemblyAPPLIED MATERIALS INC·Filed 2018·Granted Sep 10, 2019·0 cites·14 claims
- 2272US11574831B2Method and apparatus for substrate transfer and radical confinementAPPLIED MATERIALS INC·Filed 2020·Granted Feb 7, 2023·0 cites·18 claims
- 2372US11171008B2Abatement and strip process chamber in a dual load lock configurationAPPLIED MATERIALS INC·Filed 2019·Granted Nov 9, 2021·1 cites·20 claims
- 2464US2020066563A1Method and apparatus for substrate transfer and radical confinementAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2562US10468282B2Method and apparatus for substrate transfer and radical confinementAPPLIED MATERIALS INC·Filed 2018·Granted Nov 5, 2019·0 cites·14 claims
- 2662US9464732B2Apparatus for uniform pumping within a substrate process chamberAPPLIED MATERIALS INC·Filed 2013·Granted Oct 11, 2016·1 cites·20 claims
- 2760US2025006465A1Remote Plasma Source and Plasma Processing Chamber Having SameAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2858US11177136B2Abatement and strip process chamber in a dual loadlock configurationAPPLIED MATERIALS INC·Filed 2019·Granted Nov 16, 2021·0 cites·17 claims
- 2958US2019221463A1Process kit components for use with an extended and independent rf powered cathode substrate for extreme edge tunabilityAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3057USD699692SUpper linerYOUSIF IMAD·Filed 2012·Granted Feb 18, 2014·10 cites·1 claims
- 3157US2024363313A1CHAMBER LID Temperature COOLING SYSTEMAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3256US9330887B2Plasma reactor with tiltable overhead RF inductive sourceAPPLIED MATERIALS INC·Filed 2013·Granted May 3, 2016·0 cites·8 claims
- 3356US2025323023A1Heated Lid Ring for Chamber Wall Temperature ControlAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3455US2025279313A1Lid and hydbrid substrate support for efficient heating and cooling in process chambersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3553US2025266270A1System and method for near substrate gas deliveryAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3653US2023335376A1Remote surface wave propagation for semiconductor chambersAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3752US2025293004A1Semiconductor processing chamber lid and sealing mechanismAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3848US6123097AApparatus and methods for controlling process chamber pressureAPPLIED MATERIALS INC·Filed 1996·Granted Sep 26, 2000·13 cites·17 claims
- 3947US10453694B2Abatement and strip process chamber in a dual loadlock configurationLEE JARED AHMAD·Filed 2012·Granted Oct 22, 2019·0 cites·20 claims
- 4047US2009277874A1Method and apparatus for removing polymer from a substrateAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 4146US2011120505A1Apparatus and method for front side protection during backside cleaningAPPLIED MATERIALS INC·Filed 2011·Application pending·0 cites
- 4246US2018061616A1Low pressure lift pin cavity hardwareAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 4346US2013334199A1Thin heated substrate supportYOUSIF IMAD·Filed 2012·Application pending·0 cites
- 4445US2014262044A1Mu metal shield coverAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 4544US2008179287A1Process for wafer backside polymer removal with wafer front side gas purgeCOLLINS KENNETH S·Filed 2007·Application pending·0 cites
- 4644US2008179288A1Process for wafer backside polymer removal and wafer front side scavenger plasmaCOLLINS KENNETH S·Filed 2007·Application pending·0 cites
- 4741US2013105085A1Plasma reactor with chamber wall temperature controlAPPLIED MATERIALS INC·Filed 2012·Application pending·0 cites
- 4840US2020152425A1Substrate processing chamber component assembly with plasma resistant sealAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 4939US2012222813A1Vacuum chambers with shared pumpPAL ANIRUDDHA·Filed 2012·Application pending·0 cites
- 5038US2018122655A1Endpoint gas line filter for substrate processing equipmentAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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