Inventor · disambiguated record
Tetsuya Hiraoka
Also filed as: HIRAOKA TETSUYA
12 granted patents·4 pending applications·854 citations·filing 1993–2024
93Inventor score
Files withFUJITSU LTD9FUJITSU MICROELECTRONICS LTD1FUJITSU SEMICONDUCTOR LTD1HIRAOKA TETSUYA1NEC CORP1
Top patents by PatentIndex Score
16 records- 0197US6316838B1Semiconductor deviceFUJITSU LTD·Filed 2000·Granted Nov 13, 2001·571 cites·8 claims
- 0290US5293072ASemiconductor device having spherical terminals attached to the lead frame embedded within the package bodyFUJITSU LTD·Filed 1993·Granted Mar 8, 1994·97 cites·6 claims
- 0387US6972487B2Multi chip package structure having a plurality of semiconductor chips mounted in the same packageFUJITSU LTD·Filed 2002·Granted Dec 6, 2005·36 cites·14 claims
- 0484US5566545AProcess and an apparatus for treating an exhaust gas, and a honeycomb structural exhaust gas filterNGK INSULATORS LTD·Filed 1994·Granted Oct 22, 1996·60 cites·25 claims
- 0577US7528460B2Semiconductor device sealed with electrical insulation sealing memberFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted May 5, 2009·6 cites·14 claims
- 0676US6740970B2Semiconductor device with stack of semiconductor chipsFUJITSU LTD·Filed 2001·Granted May 25, 2004·24 cites·4 claims
- 0772US8048719B2Semiconductor device and manufacturing method thereofFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Nov 1, 2011·4 cites·1 claims
- 0862US5403776AProcess of using a jig to align and mount terminal conductors to a semiconductor plastic packageFUJITSU LTD·Filed 1993·Granted Apr 4, 1995·27 cites·6 claims
- 0957US2025023663A1Communication apparatus and communication systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 1055US7138723B2Deformable semiconductor deviceFUJITSU LTD·Filed 2004·Granted Nov 21, 2006·6 cites·2 claims
- 1154US6580173B2Semiconductor device and manufacturing method of semiconductor deviceFUJITSU LTD·Filed 2000·Granted Jun 17, 2003·6 cites·4 claims
- 1252US6459161B1Semiconductor device with connection terminals in the form of a grid arrayNEC CORP·Filed 1999·Granted Oct 1, 2002·17 cites·14 claims
- 1352US2024203765A1Substrate processing apparatus, substrate processing system, and data processing methodSCREEN HOLDINGS CO LTD·Filed 2022·Application pending·0 cites
- 1449US2006226529A1Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrateFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1547US2005161794A1Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrateFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1633US8653381B2Wiring board comprising wirings arranged with crest and troughHIRAOKA TETSUYA·Filed 2011·Granted Feb 18, 2014·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →