Inventor · disambiguated record
Kiyohiko Maeda
Also filed as: MAEDA KIYOHIKO
35 granted patents·6 pending applications·402 citations·filing 1996–2020
97Inventor score
Files withHITACHI INT ELECTRIC INC21KOKUSAI ELECTRIC CO LTD7OZAKI TAKASHI5KOKUSAI ELECTRIC CORP3HITACHI KOKUSAI ELECTRIC IN1
Top patents by PatentIndex Score
41 records- 0194US6486083B1Semiconductor device manufacturing method and semiconductor manufacturing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2000·Granted Nov 26, 2002·74 cites·18 claims
- 0293US8043431B2Substrate processing apparatus and method for manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Granted Oct 25, 2011·16 cites·9 claims
- 0390US7871938B2Producing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Granted Jan 18, 2011·10 cites·18 claims
- 0489US8282737B2Substrate processing apparatus and method for manufacturing a semiconductor deviceOZAKI TAKASHI·Filed 2011·Granted Oct 9, 2012·4 cites·9 claims
- 0588US8575042B2Method of manufacturing semiconductor device and method of processing substrate and substrate processing apparatusOTA YOSUKE·Filed 2012·Granted Nov 5, 2013·7 cites·14 claims
- 0688US7494941B2Manufacturing method of semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2004·Granted Feb 24, 2009·46 cites·16 claims
- 0787US8084369B2Producing method of semiconductor device and substrate processing apparatusOZAKI TAKASHI·Filed 2009·Granted Dec 27, 2011·8 cites·18 claims
- 0886US10229829B2Method for manufacturing semiconductor device, substrate-processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 12, 2019·3 cites·2 claims
- 0986US7883581B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Granted Feb 8, 2011·11 cites·11 claims
- 1086US6524650B1Substrate processing apparatus and methodKOKUSAI ELECTRIC CO LTD·Filed 2000·Granted Feb 25, 2003·32 cites·8 claims
- 1185US10840094B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Nov 17, 2020·4 cites·19 claims
- 1284US8304328B2Manufacturing method of semiconductor device and substrate processing apparatusMAEDA TAKAHIRO·Filed 2007·Granted Nov 6, 2012·10 cites·26 claims
- 1383US9698007B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 4, 2017·3 cites·16 claims
- 1483US7534730B2Producing method of semiconductor device and substrate processing apparatusHITACHI KOKUSAI ELECTRIC IN·Filed 2004·Granted May 19, 2009·25 cites·27 claims
- 1582US9793107B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 17, 2017·4 cites·16 claims
- 1682US9177786B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Nov 3, 2015·5 cites·13 claims
- 1780US10163625B2Method for manufacturing semiconductor device, substrate-processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Dec 25, 2018·2 cites·11 claims
- 1879USD740769SBoat for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Granted Oct 13, 2015·23 cites·1 claims
- 1977US8057599B2Substrate processing apparatus and method for manufacturing a semiconductor deviceOZAKI TAKASHI·Filed 2004·Granted Nov 15, 2011·14 cites·15 claims
- 2076US7795143B2Substrate processing apparatus and manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2007·Granted Sep 14, 2010·6 cites·12 claims
- 2174US6139642ASubstrate processing apparatus and methodKOKUSAI ELECTRIC CO LTD·Filed 1998·Granted Oct 31, 2000·37 cites·26 claims
- 2273US8293646B2Semiconductor device manufacturing method and substrate processing apparatusOZAKI TAKASHI·Filed 2005·Granted Oct 23, 2012·4 cites·13 claims
- 2369USD739831SBoat for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Granted Sep 29, 2015·15 cites·1 claims
- 2469US8679989B2Method of manufacturing semiconductor device including removal of deposits from process chamber and supply portionNAKASHIMA SADAO·Filed 2007·Granted Mar 25, 2014·2 cites·20 claims
- 2567US7879400B2Substrate processing apparatus, method of manufacturing a semiconductor device, and method of forming a thin film on metal surfaceHITACHI INT ELECTRIC INC·Filed 2007·Granted Feb 1, 2011·2 cites·14 claims
- 2664US9666430B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 30, 2017·1 cites·13 claims
- 2763US6716772B2Semiconductor device manufacturing method and semiconductor manufacturing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2002·Granted Apr 6, 2004·7 cites·14 claims
- 2861US10497561B2Method for manufacturing semiconductor device, substrate-processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 3, 2019·0 cites·15 claims
- 2958US8497192B2Method of manufacturing a semiconductor device and substrate processing apparatusISHIBASHI KIYOHISA·Filed 2011·Granted Jul 30, 2013·1 cites·11 claims
- 3058US5902103AVertical furnace of a semiconductor manufacturing apparatus and a boat cover thereofKOKUSAI ELECTRIC CO LTD·Filed 1996·Granted May 11, 1999·26 cites·7 claims
- 3157US12461507B2Substrate processing apparatus, substrate processing method, semiconductor device manufacturing method, and control programKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 4, 2025·0 cites·18 claims
- 3255US9349587B2Method of manufacturing semiconductor device and method of processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Granted May 24, 2016·0 cites·19 claims
- 3354US7432215B2Semiconductor device manufacturing method and semiconductor manufacturing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2007·Granted Oct 7, 2008·0 cites·10 claims
- 3453US2012064730A1Producing method of semiconductor device and substrate processing apparatusOZAKI TAKASHI·Filed 2011·Application pending·0 cites
- 3550US7858534B2Semiconductor device manufacturing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Granted Dec 28, 2010·0 cites·3 claims
- 3650US2013305991A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 3749US2015370245A1Substrate processing apparatus, substrate processing method, semiconductor device manufacturing method, and control programHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 3849US2006121746A1Semiconductor device manufacturing method and semiconductor manufacturing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2006·Application pending·0 cites
- 3949US2013068159A1Manufacturing Method of Semiconductor Device and Substrate Processing ApparatusHITACHI INT ELECTRIC INC·Filed 2012·Application pending·0 cites
- 4048US2013149846A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 4144US8367530B2Substrate processing apparatus and manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2010·Granted Feb 5, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →