Inventor · disambiguated record
Woo Kyung You
Also filed as: YOU WOO KYUNG
22 granted patents·6 pending applications·533 citations·filing 2014–2023
93Inventor score
Top patents by PatentIndex Score
28 records- 0198US9281277B2Methods of forming wiring structuresSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 8, 2016·491 cites·12 claims
- 0292US10475739B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 12, 2019·8 cites·20 claims
- 0390US10199263B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 5, 2019·7 cites·20 claims
- 0484US9812450B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·10 claims
- 0584US9653400B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 16, 2017·5 cites·20 claims
- 0682US10008407B2Methods of manufacturing semiconductor devices including conductive structuresSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 26, 2018·4 cites·19 claims
- 0779US12218002B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0878US10867923B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 15, 2020·2 cites·8 claims
- 0978US10304734B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 28, 2019·2 cites·20 claims
- 1075US10062609B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·20 claims
- 1175US9812353B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·2 cites·20 claims
- 1272US11881430B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 1372US10847454B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·1 cites·20 claims
- 1472US9390966B2Methods of forming wiring structures and methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 12, 2016·2 cites·20 claims
- 1570US10510658B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 1670US9396988B2Methods for fabricating semiconductor devices using liner layers to avoid damage to underlying patternsLEE KYOUNG-WOO·Filed 2015·Granted Jul 19, 2016·2 cites·20 claims
- 1765US11348827B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·0 cites·17 claims
- 1860US10832948B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 10, 2020·0 cites·16 claims
- 1957US2024194752A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2057US2024204107A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2155US2023307370A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2254US10777449B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 2354US9984921B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 29, 2018·0 cites·20 claims
- 2453US10658231B2Semiconductor device with air gap between wires and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 19, 2020·0 cites·18 claims
- 2553US2019304903A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2647US2017213786A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2746US2016133577A1Wiring Structures and Methods of Forming the SameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2843US10916437B2Methods of forming micropatterns and substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 9, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →