Inventor · disambiguated record
Seon Hee Moon
Also filed as: MOON SEON HEE
11 granted patents·7 pending applications·82 citations·filing 2009–2020
88Inventor score
Files withSAMSUNG ELECTRO MECH7SAMSUNG ELECTRONICS CO LTD4JEON HYUNG JIN2PARK SEUNG WOOK2HONG JU PYO1
Top patents by PatentIndex Score
18 records- 0198US10727212B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 28, 2020·36 cites·32 claims
- 0292US10748856B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·8 cites·16 claims
- 0388US9345142B2Chip embedded board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted May 17, 2016·8 cites·7 claims
- 0488US8093705B2Dual face package having resin insulating layerPARK SEUNG WOOK·Filed 2009·Granted Jan 10, 2012·14 cites·8 claims
- 0587US8273660B2Method of manufacturing a dual face packagePARK SEUNG WOOK·Filed 2011·Granted Sep 25, 2012·8 cites·13 claims
- 0674US7947530B2Method of manufacturing wafer level package including coating and removing resin over the dicing linesSAMSUNG ELECTRO MECH·Filed 2009·Granted May 24, 2011·5 cites·6 claims
- 0770US11075193B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 27, 2021·1 cites·21 claims
- 0869US9196506B2Method for manufacturing interposerSAMSUNG ELECTRO MECH·Filed 2012·Granted Nov 24, 2015·2 cites·8 claims
- 0961US11515265B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·16 claims
- 1052US2014251657A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1152US2011061911A1Interposer and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1246US8624128B2Printed circuit board and manufacturing method thereofHONG JU-PYO·Filed 2011·Granted Jan 7, 2014·0 cites·8 claims
- 1346US2011201156A1Method of manufacturing wafer level package including coating resin over the dicing linesSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 1445US2011097856A1Method of manufacturing wafer level packageKIM HONG WON·Filed 2009·Application pending·0 cites
- 1543US2015083480A1Interposer board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1642US8756804B2Method of manufacturing printed circuit boardJEON HYUNG JIN·Filed 2011·Granted Jun 24, 2014·0 cites·5 claims
- 1736US2012161323A1Substrate for package and method for manufacturing the sameKIM YOON SU·Filed 2011·Application pending·0 cites
- 1832US2012012378A1Printed circuit board and method of manufacturing the sameJEON HYUNG JIN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →