Method of manufacturing wafer level package including coating resin over the dicing lines

Abstract

A method of manufacturing a wafer level package including: preparing a substrate wafer including a plurality of pads formed on a bottom surface, a plurality of chips positioned on a top surface, and dicing lines for dividing the chips; forming external connection units on the pads; coating resin on the dicing lines by positioning masks on the substrate wafer to expose only the dicing lines; removing the masks; encapsulating the chips positioned between the resin by coating the chips with encapsulant and cutting a wafer level package along the dicing lines coated with the resin into units.

1 . A method of manufacturing a wafer level package comprising:
 preparing a substrate wafer including a plurality of pads formed on a bottom surface, a plurality of chips positioned on a top surface, and dicing lines for dividing the chips;   forming external connection units on the pads;   coating resin on the dicing lines by positioning masks on the substrate wafer to expose only the dicing lines;   removing the masks;   encapsulating the chips positioned between the resin by coating the chips with encapsulant; and   cutting a wafer level package along the dicing lines coated with the resin into units.   
     
     
         2 . The method of  claim 1 , wherein the resin is formed of any one of transparent photocurable, thermosetting, and thermoplastic resin in the coating the resin on the dicing lines.