Printed circuit board and method of manufacturing the same

Abstract

Embodiments of the invention provide a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided.

What is claimed is: 
     
         1 . A printed circuit board, comprising:
 a base member;   an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened;   a circuit layer formed on the insulating layer; and   a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member.   
     
     
         2 . The printed circuit board as set forth in  claim 1 , wherein the base member comprises a ceramic material or an organic material. 
     
     
         3 . The printed circuit board as set forth in  claim 1 , further comprising a protection layer formed on the circuit layer. 
     
     
         4 . The printed circuit board as set forth in  claim 1 , wherein the circuit layer comprises a pad exposed to outside and a pad protection layer formed on the pad. 
     
     
         5 . The printed circuit hoard as set forth in  claim 1 , wherein the circuit layer has a multilayer structure. 
     
     
         6 . The printed circuit board as set forth in  claim 3 , wherein the protection layer has an opening for exposing the pad of the circuit layer or the via. 
     
     
         7 . The printed circuit board as set forth in  claim 6 , wherein the opening is subjected to rounding treatment so as to be imparted with a shape which has a diameter that increases as the opening becomes more distant from the base member. 
     
     
         8 . The printed circuit board as set forth in  claim 6 , wherein the protection layer is formed by means of a photoresist using a liquid photodefinable material, and the opening of the protection layer is formed using photo-exposure and development. 
     
     
         9 . The printed circuit board as set forth in  claim 3 , wherein a thickness from one surface of the circuit layer in contact with the protection layer to an exposed surface of the protection layer is 15 μm or less.