Inventor · disambiguated record
Suketu Arun Parikh
Also filed as: PARIKH SUKETU · PARIKH SUKETU A · PARIKH SUKETU ARUN
49 granted patents·18 pending applications·517 citations·filing 1998–2025
98Inventor score
Top patents by PatentIndex Score
67 records- 0196US10629484B1Method of forming self-aligned viaAPPLIED MATERIALS INC·Filed 2018·Granted Apr 21, 2020·12 cites·16 claims
- 0291US6656840B2Method for forming silicon containing layers on a substrateAPPLIED MATERIALS INC·Filed 2002·Granted Dec 2, 2003·54 cites·18 claims
- 0391US6225207B1Techniques for triple and quadruple damascene fabricationAPPLIED MATERIALS INC·Filed 1998·Granted May 1, 2001·111 cites·32 claims
- 0489US8828517B2Structure and method for improving solar cell efficiency and mechanical strengthWANG DAVID XUAN-QI·Filed 2010·Granted Sep 9, 2014·5 cites·2 claims
- 0589US6940170B2Techniques for triple and quadruple damascene fabricationAPPLIED MATERIALS INC·Filed 2001·Granted Sep 6, 2005·50 cites·22 claims
- 0689US6127263AMisalignment tolerant techniques for dual damascene fabricationAPPLIED MATERIALS INC·Filed 1998·Granted Oct 3, 2000·93 cites·40 claims
- 0788US11682668B2Stacked transistor deviceAPPLIED MATERIALS INC·Filed 2021·Granted Jun 20, 2023·1 cites·14 claims
- 0888US8005634B2Copper wiring module controlAPPLIED MATERIALS INC·Filed 2007·Granted Aug 23, 2011·11 cites·32 claims
- 0988US7205228B2Selective metal encapsulation schemesAPPLIED MATERIALS INC·Filed 2004·Granted Apr 17, 2007·40 cites·33 claims
- 1087US11054815B2Apparatus for cost-effective conversion of unsupervised fault detection (FD) system to supervised FD systemAPPLIED MATERIALS INC·Filed 2017·Granted Jul 6, 2021·6 cites·16 claims
- 1185US11495461B2Film stack for lithography applicationsAPPLIED MATERIALS INC·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
- 1284US6514671B1Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristicsAPPLIED MATERIALS INC·Filed 2000·Granted Feb 4, 2003·39 cites·14 claims
- 1382US10892198B2Systems and methods for improved performance in semiconductor processingAPPLIED MATERIALS INC·Filed 2018·Granted Jan 12, 2021·4 cites·14 claims
- 1481US10923396B2Method of forming self-aligned viaAPPLIED MATERIALS INC·Filed 2020·Granted Feb 16, 2021·1 cites·7 claims
- 1580US6842659B2Method and apparatus for providing intra-tool monitoring and controlAPPLIED MATERIALS INC·Filed 2001·Granted Jan 11, 2005·18 cites·15 claims
- 1679US11049770B2Methods and apparatus for fabrication of self aligning interconnect structureAPPLIED MATERIALS INC·Filed 2020·Granted Jun 29, 2021·1 cites·20 claims
- 1778US11075165B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 27, 2021·2 cites·18 claims
- 1875US11309404B2Integrated CMOS source drain formation with advanced controlAPPLIED MATERIALS INC·Filed 2019·Granted Apr 19, 2022·1 cites·14 claims
- 1975US7781154B2Method of forming damascene structureAPPLIED MATERIALS INC·Filed 2006·Granted Aug 24, 2010·5 cites·26 claims
- 2075US2025029874A1Low Resistance and High Reliability Metallization ModuleAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2174US2025293086A1Methods and apparatus for selective etch stop capping and selective via open for fully landed via on underlying metalAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2273US2023360965A1Self-alignment etching of interconnect layersAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2372US8849438B2Factory level process and final product performance control systemPARIKH SUKETU ARUN·Filed 2011·Granted Sep 30, 2014·3 cites·18 claims
- 2471US10867858B2Simultaneous metal patterning for 3D interconnectsAPPLIED MATERIALS INC·Filed 2019·Granted Dec 15, 2020·1 cites·20 claims
- 2571US10695804B2Equipment cleaning apparatus and methodAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·1 cites·19 claims
- 2671US6594540B1Misalignment tolerant techniques for dual damascene fabricationAPPLIED MATERIALS INC·Filed 2000·Granted Jul 15, 2003·15 cites·32 claims
- 2770US12334394B2Methods and apparatus for selective etch stop capping and selective via open for fully landed via on underlying metalAPPLIED MATERIALS INC·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2870US11749561B2Self-alignment etching of interconnect layersAPPLIED MATERIALS INC·Filed 2021·Granted Sep 5, 2023·0 cites·13 claims
- 2970US9184333B2Contact and interconnect metallization for solar cellsAPPLIED MATERIALS INC·Filed 2013·Granted Nov 10, 2015·2 cites·13 claims
- 3069US11270914B2Method of forming self-aligned viaAPPLIED MATERIALS INC·Filed 2021·Granted Mar 8, 2022·0 cites·9 claims
- 3169US2022199804A1Integrated CMOS Source Drain Formation With Advanced ControlAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3268US7074626B2Method and apparatus for providing intra-tool monitoring and controlAPPLIED MATERIALS INC·Filed 2004·Granted Jul 11, 2006·8 cites·24 claims
- 3367US7572734B2Etch depth control for dual damascene fabrication processAPPLIED MATERIALS INC·Filed 2007·Granted Aug 11, 2009·2 cites·20 claims
- 3466US12495582B2Self-aligned wide backside power rail contacts to multiple transistor sourcesAPPLIED MATERIALS INC·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 3566US11658041B2Methods of modifying portions of layer stacksAPPLIED MATERIALS INC·Filed 2021·Granted May 23, 2023·0 cites·19 claims
- 3665US12416080B2Atomic layer self aligned substrate processing and integrated toolsetAPPLIED MATERIALS INC·Filed 2021·Granted Sep 16, 2025·0 cites·4 claims
- 3765US12148660B2Low resistance and high reliability metallization moduleAPPLIED MATERIALS INC·Filed 2021·Granted Nov 19, 2024·0 cites·10 claims
- 3865US12142487B2Methods of modifying portions of layer stacksAPPLIED MATERIALS INC·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 3964US11948885B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 4064US9437479B2Methods for forming an interconnect pattern on a substrateAPPLIED MATERIALS INC·Filed 2014·Granted Sep 6, 2016·1 cites·18 claims
- 4164US8409952B2Method of forming an electronic device including forming a charge storage element in a trench of a workpiecePARIKH SUKETU ARUN·Filed 2008·Granted Apr 2, 2013·2 cites·19 claims
- 4263US12315735B2Methods for removing etch stop layersAPPLIED MATERIALS INC·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 4363US6391771B1Integrated circuit interconnect lines having sidewall layersAPPLIED MATERIALS INC·Filed 1998·Granted May 21, 2002·26 cites·18 claims
- 4462US11557509B1Self-alignment etching of interconnect layersAPPLIED MATERIALS INC·Filed 2019·Granted Jan 17, 2023·0 cites·20 claims
- 4560US12183631B2Methods for copper doped hybrid metallization for line and viaAPPLIED MATERIALS INC·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 4660US11177254B2Stacked transistor deviceAPPLIED MATERIALS INC·Filed 2019·Granted Nov 16, 2021·0 cites·17 claims
- 4760US2025271846A1Autonomous fault diagnostic tools for manufacturing systems by analyzing process runsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4858US11131022B2Atomic layer self aligned substrate processing and integrated toolsetAPPLIED MATERIALS INC·Filed 2019·Granted Sep 28, 2021·0 cites·14 claims
- 4956US2024387458A1Three-Dimensional Vertical Interconnect Architecture and Methods For FormingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 5055US2025035680A1Methods and mechanisms to improve monitoring capabilities using rate of change of sensor valuesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →