Inventor · disambiguated record
Michiyoshi Takano
Also filed as: TAKANO MICHIYOSHI
11 granted patents·9 pending applications·58 citations·filing 2001–2023
89Inventor score
Top patents by PatentIndex Score
20 records- 0189US7276792B2Semiconductor device, circuit substrate, electro-optic device and electronic applianceSEIKO EPSON CORP·Filed 2005·Granted Oct 2, 2007·8 cites·12 claims
- 0286US7230338B2Semiconductor device that improves electrical connection reliabilitySEIKO EPSON CORP·Filed 2005·Granted Jun 12, 2007·14 cites·7 claims
- 0377US7888799B2Semiconductor device, circuit substrate, electro-optic device and electronic applianceSEIKO EPSON CORP·Filed 2010·Granted Feb 15, 2011·2 cites·15 claims
- 0475US7741712B2Semiconductor device, circuit substrate, electro-optic device and electronic applianceSEIKO EPSON CORP·Filed 2007·Granted Jun 22, 2010·2 cites·18 claims
- 0562US7560814B2Semiconductor device that improves electrical connection reliabilitySEIKO EPSON CORP·Filed 2007·Granted Jul 14, 2009·2 cites·12 claims
- 0662US7233067B2Manufacturing a bump electrode with roughened faceSEIKO EPSON CORP·Filed 2004·Granted Jun 19, 2007·8 cites·8 claims
- 0758US2024170380A1Semiconductor PackageSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0857US7157308B2Circuit substrates, semiconductor devices, semiconductor manufacturing apparatus methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devicesSEIKO EPSON CORP·Filed 2004·Granted Jan 2, 2007·8 cites·7 claims
- 0957US6872651B2Manufacturing a bump electrode with roughened faceSEIKO EPSON CORP·Filed 2003·Granted Mar 29, 2005·6 cites·7 claims
- 1055US7638886B2Semiconductor device and semiconductor chipSEIKO EPSON CORP·Filed 2006·Granted Dec 29, 2009·1 cites·1 claims
- 1155US6605523B2Manufacturing method for semiconductor deviceSEIKO EPSON CORP·Filed 2001·Granted Aug 12, 2003·7 cites·12 claims
- 1249US2009035929A1Method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 1349US2007124928A1Circuit substrates, semiconductor devices, semiconductor manufacturing apparatuses, methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devicesSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 1449US2007267744A1Manufacturing a bump electrode with roughened faceSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 1547US8136238B2Methods for manufacturing semiconductor devicesTAKANO MICHIYOSHI·Filed 2009·Granted Mar 20, 2012·0 cites·6 claims
- 1645US2005272243A1Method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2005·Application pending·0 cites
- 1740US2007026661A1Method of manufacturing a semiconductor deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 1839US2004217470A1Circuit substrates, semiconductor devices, semiconductor manufacturing apparatuses, methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devicesFiled 2004·Application pending·0 cites
- 1938US2003145947A1Semiconductor device, method of manufacturing the same, manufacturing apparatus for the same, and electronic instrumentSEIKO EPSON CORP·Filed 2003·Application pending·0 cites
- 2038US2003173108A1Semiconductor device and method of manufacturing the same, circuit board and electronic equipmentSEIKO EPSON CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →