Circuit substrates, semiconductor devices, semiconductor manufacturing apparatuses, methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices

Abstract

A method is provided to control the height of bump electrodes and increase a clearance between edge sections of a semiconductor chip and lead terminals of a tape substrate. By pushing up on a tape substrate by a bonding stage, and applying suction to the tape substrate through a suction groove, boundary portions of a semiconductor chip mounting region are drawn into the suction groove, and curved sections are formed in the tape substrate at locations corresponding to edge sections of a semiconductor chip and inclined sections disposed in outer circumference sections of the curved sections are formed in the tape substrate.

1 . A semiconductor manufacturing apparatus comprising: 
 a bonding stage that supports a circuit substrate;    a mounting device that mounts a semiconductor chip on the circuit substrate;    at least one of a groove and a hole that is provided in the bonding stage at a position corresponding to the edge position of the semiconductor chip; and    an inclined surface of the bonding stage at an outer circumference section of the edge position.    
     
     
         2 . A semiconductor manufacturing apparatus according to  claim 1 , further comprising: 
 a suction device that is provided at the bonding stage to apply suction to the at least one of the groove and the hole; and    a suction control device that controls the suction timing by the suction device based on a heating state of the circuit substrate.    
     
     
         3 . A semiconductor manufacturing apparatus according to  claim 1 , further comprising a heating device that locally heats a region in the circuit substrate corresponding to the edge position of the semiconductor chip.  
     
     
         4 . A semiconductor manufacturing apparatus according to  claim 3 , wherein the heating device comprises a laser irradiating device.  
     
     
         5 . A semiconductor manufacturing apparatus comprising: 
 a bonding head that retains a semiconductor chip;    a first temperature control device that controls a temperature of the bonding head;    a bonding stage that supports a tape substrate;    a second temperature control device that controls a temperature of the bonding stage;    at least one of a suction groove and a suction hole that is provided in the bonding stage and disposed at a position corresponding to an edge position of the semiconductor chip;    an inclined surface of the bonding stage in an outer circumference section of the edge position;    a vacuum pump that applies suction to the at least one of the suction groove and the suction hole;    a clamp device that clamps the tape substrate;    a first image recognition device that performs image recognition of the semiconductor chip;    a second image recognition device that performs image recognition of the tape substrate;    a first positioning device that positions the bonding stage in X•Y•θ directions based on a result of the image recognition by the second image recognition device;    a second positioning device that positions the bonding head in X•Y•θ directions based on a result of the image recognition by the first and second image recognition devices;    a first pressing device that presses the bonding stage against the tape substrate, after the bonding stage is positioned by the first positioning device; and    a second pressing device that presses the semiconductor chip retained by the bonding head against the tape substrate, after the bonding head is positioned by the second positioning device.    
     
     
         6 . A semiconductor manufacturing apparatus according to  claim 5 , wherein the at least one of the groove and the hole includes a region between the bump electrodes provided on the semiconductor chip and the edge position of the semiconductor chip.  
     
     
         7 . A semiconductor manufacturing apparatus according to  claim 5 , wherein the at least one of the groove and the hole is chamfered or has rounded corners.  
     
     
         8 . A semiconductor manufacturing apparatus according to  claim 1 , wherein the at least one of the groove and the hole includes a region between the bump electrodes provided on the semiconductor chip and the edge position of the semiconductor chip.  
     
     
         9 . A semiconductor manufacturing apparatus according to  claim 1 , wherein the at least one of the groove and the hole is chamfered or has rounded corners.