Inventor · disambiguated record
Hajime Eda
Also filed as: EDA HAJIME
8 granted patents·13 pending applications·10 citations·filing 2009–2017
78Inventor score
Top patents by PatentIndex Score
21 records- 0178US9144879B2Planarization method and planarization apparatusTOSHIBA KK·Filed 2013·Granted Sep 29, 2015·3 cites·7 claims
- 0276US8575030B2Semiconductor device manufacturing methodMINAMIHABA GAKU·Filed 2011·Granted Nov 5, 2013·4 cites·20 claims
- 0367US8114776B2Method of manufacturing semiconductor deviceEDA HAJIME·Filed 2010·Granted Feb 14, 2012·3 cites·21 claims
- 0456US10010997B2Abrasive cloth and polishing methodTOSHIBA MEMORY CORP·Filed 2015·Granted Jul 3, 2018·0 cites·16 claims
- 0555US9174322B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2014·Granted Nov 3, 2015·0 cites·20 claims
- 0654US8754433B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2012·Granted Jun 17, 2014·0 cites·8 claims
- 0751US10283383B2Planarization method and planarization apparatusTOSHIBA MEMORY CORP·Filed 2015·Granted May 7, 2019·0 cites·13 claims
- 0846US2014365279A1Information management device, information management method, and non-transitory storage mediumNEC SOLUTION INNOVATORS LTD·Filed 2013·Application pending·0 cites
- 0946US2013331004A1Semiconductor device manufacturing method and chemical mechanical polishing methodJSR CORP·Filed 2013·Application pending·0 cites
- 1046US2013331005A1Semiconductor device manufacturing methodTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1146US2014004775A1Method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1245US9012246B2Manufacturing method of semiconductor device and polishing apparatusTOSHIBA KK·Filed 2013·Granted Apr 21, 2015·0 cites·12 claims
- 1344US2011294291A1Semiconductor device and method of manufacturing the sameMATSUI YUKITERU·Filed 2011·Application pending·0 cites
- 1443US2009258493A1Semiconductor device manufacturing methodMATSUI YUKITERU·Filed 2009·Application pending·0 cites
- 1541US2019266565A1Process design support apparatus, process design support method, and programNEC CORP·Filed 2017·Application pending·0 cites
- 1638US2013290365A1Component management apparatus, component management method and non-transitory storage mediumTANOUE MITSUTERU·Filed 2011·Application pending·0 cites
- 1737US2013078784A1Cmp slurry and method for manufacturing semiconductor deviceMINAMIHABA GAKU·Filed 2012·Application pending·0 cites
- 1833US2013045596A1Semiconductor device manufacturing method and polishing apparatusEDA HAJIME·Filed 2012·Application pending·0 cites
- 1933US2013040456A1Method of manufacturing semiconductor deviceEDA HAJIME·Filed 2012·Application pending·0 cites
- 2033US2013095661A1Cmp method, cmp apparatus and method of manufacturing semiconductor deviceGAWASE AKIFUMI·Filed 2012·Application pending·0 cites
- 2131US2011070745A1Polishing method, polishing apparatus, and manufacturing method of semiconductor deviceMATSUI YUKITERU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →