Inventor · disambiguated record
Kensuke Ide
Also filed as: IDE KENSUKE
28 granted patents·8 pending applications·360 citations·filing 1985–2017
96Inventor score
Files withYAMAHA CORP10MITSUBISHI HEAVY IND LTD7MITSUBISHI HEAVY IND MACHINE TOOL CO LTD5KINOUCHI MASATO4TSUNO TAKESHI4
Top patents by PatentIndex Score
36 records- 0194US7119268B2Portable telephony apparatus with music tone generatorYAMAHA CORP·Filed 2003·Granted Oct 10, 2006·55 cites·51 claims
- 0293US5892171AMethod of extending capability of music apparatus by networkingYAMAHA CORP·Filed 1997·Granted Apr 6, 1999·105 cites·19 claims
- 0392US6911592B1Portable telephony apparatus with music tone generatorYAMAHA CORP·Filed 2000·Granted Jun 28, 2005·44 cites·78 claims
- 0491US7161081B2Portable telephony apparatus with music tone generatorYAMAHA CORP·Filed 2003·Granted Jan 9, 2007·38 cites·18 claims
- 0578US9443711B2Room-temperature bonding apparatusKINOUCHI MASATO·Filed 2012·Granted Sep 13, 2016·5 cites·6 claims
- 0678US7531737B2Music processing apparatus and management method thereforYAMAHA CORP·Filed 2007·Granted May 12, 2009·12 cites·11 claims
- 0778US6967276B2Portable telephony apparatus with music tone generatorYAMAHA CORP·Filed 2003·Granted Nov 22, 2005·12 cites·35 claims
- 0877US7091410B2Apparatus and computer program for providing arpeggio patternsYAMAHA CORP·Filed 2004·Granted Aug 15, 2006·22 cites·11 claims
- 0976US9130000B2Wafer bonding device and wafer bonding methodTSUNO TAKESHI·Filed 2009·Granted Sep 8, 2015·6 cites·8 claims
- 1074US7514624B2Portable telephony apparatus with music tone generatorYAMAHA CORP·Filed 2003·Granted Apr 7, 2009·10 cites·18 claims
- 1173US6698982B2Machine toolMITSUBISHI HEAVY IND LTD·Filed 2002·Granted Mar 2, 2004·13 cites·9 claims
- 1265US8936998B2Manufcaturing method for room-temperature substrate bondingUTSUMI JUN·Filed 2013·Granted Jan 20, 2015·2 cites·10 claims
- 1363US8906175B2Room temperature bonding apparatusKINOUCHI MASATO·Filed 2009·Granted Dec 9, 2014·2 cites·11 claims
- 1462US10112376B2Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatusMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2016·Granted Oct 30, 2018·0 cites·13 claims
- 1560US9064910B2Bonding unit control unit and multi-layer bonding methodKINOUCHI MASATO·Filed 2010·Granted Jun 23, 2015·1 cites·7 claims
- 1660US8857487B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2008·Granted Oct 14, 2014·1 cites·13 claims
- 1758US8985175B2Room temperature bonding machine and room temperature bonding methodKINOUCHI MASATO·Filed 2008·Granted Mar 24, 2015·1 cites·4 claims
- 1857US2010276723A1Device and device manufacture methodMITSUBUISHI HEAVY IND LTD·Filed 2008·Application pending·0 cites
- 1955USRE38554EMethod of extending capability of music apparatus by networkingYAMAHA CORP·Filed 2001·Granted Jul 13, 2004·5 cites·34 claims
- 2054US4719578AProfiling control apparatus and control method thereofMITSUBISHI HEAVY IND LTD·Filed 1985·Granted Jan 12, 1988·13 cites·4 claims
- 2151US7940263B2Curved-surface generating method and program, and three-dimensional shape processing apparatusMITSUBISHI HEAVY IND LTD·Filed 2006·Granted May 10, 2011·2 cites·6 claims
- 2250US8602289B2Room temperature bonding using sputteringGOTO TAKAYUKI·Filed 2007·Granted Dec 10, 2013·0 cites·11 claims
- 2349US2010092786A1Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatusMITSUBISHI HEAVY IND LTD·Filed 2007·Application pending·0 cites
- 2446US9005390B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2012·Granted Apr 14, 2015·0 cites·10 claims
- 2546US6429365B1Performance control apparatus and method capable of shifting performance style during performanceYAMAHA CORP·Filed 2000·Granted Aug 6, 2002·7 cites·23 claims
- 2645US8608048B2Room-temperature bonding method and room-temperature bonding apparatus including sputteringGOTO TAKAYUKI·Filed 2011·Granted Dec 17, 2013·0 cites·9 claims
- 2745US2017162428A1Room-temperature bonding apparatusMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2014·Application pending·0 cites
- 2843US9580306B2Room temperature bonding apparatus and room temperature bonding methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·16 claims
- 2941US2015249026A1Room-temperature bonding apparatus and room-temperature bonding methodMITSUBISHI HEAVY IND LTD·Filed 2013·Application pending·0 cites
- 3040US10486263B2Room-temperature-bonded semiconductor device and manufacturing method of room-temperature-bonded semiconductor deviceMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2015·Granted Nov 26, 2019·0 cites·9 claims
- 3138US2015294900A1Room-temperature bonded device, wafer having room-temperature bonded device, and room-temperature bonding methodMITSUBISHI HEAVY IND LTD·Filed 2013·Application pending·0 cites
- 3236US4747734AProfiling apparatusMITSUBISHI HEAVY IND LTD·Filed 1985·Granted May 31, 1988·4 cites·2 claims
- 3336US2019172813A1Substrate joining methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2017·Application pending·0 cites
- 3435US2013112334A1Room temperature bonding apparatus and room temperature bonding methodTSUNO TAKESHI·Filed 2011·Application pending·0 cites
- 3532US2012247645A1Bonding method, bonding apparatus, and bonding systemTSUTSUMI KEIICHIRO·Filed 2010·Application pending·0 cites
- 3625US8222508B2Tone signal creating apparatus and methodIDE KENSUKE·Filed 2010·Granted Jul 17, 2012·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →