Assignee
TSUNO TAKESHI
JP·3 granted patents·2 pending applications·7 citations·filing 2007–2012
Top patents by PatentIndex Score
5 records- 0176US9130000B2Wafer bonding device and wafer bonding methodTSUNO TAKESHI·Filed 2009·Granted Sep 8, 2015·6 cites·8 claims
- 0260US8857487B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2008·Granted Oct 14, 2014·1 cites·13 claims
- 0348US2007256774A1Method of manufacturing microstructure and manufacturing system for the sameTSUNO TAKESHI·Filed 2007·Application pending·0 cites
- 0446US9005390B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2012·Granted Apr 14, 2015·0 cites·10 claims
- 0535US2013112334A1Room temperature bonding apparatus and room temperature bonding methodTSUNO TAKESHI·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →