Inventor · disambiguated record
Charles C. Yang
Also filed as: YANG CHARLES · YANG CHARLES C · YANG CHARLES C H · YANG CHARLES CHIUN-CHIEH
15 granted patents·3 pending applications·353 citations·filing 1975–2024
94Inventor score
Files withMEMC ELECTRONIC MATERIALS8LIGHT FIELD LAB INC2YANG CHARLES C2CHIPBOND TECHNOLOGY CORP1HALCON INTERNATIONAL INC1
Top patents by PatentIndex Score
18 records- 0195US6444027B1Modified susceptor for use in chemical vapor deposition processMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Sep 3, 2002·82 cites·42 claims
- 0289US6596095B2Epitaxial silicon wafer free from autodoping and backside halo and a method and apparatus for the preparation thereofMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Jul 22, 2003·42 cites·35 claims
- 0388US6652650B2Modified susceptor for use in chemical vapor deposition processMEMC ELECTRONIC MATERIALS·Filed 2002·Granted Nov 25, 2003·35 cites·6 claims
- 0484US6284384B1Epitaxial silicon wafer with intrinsic getteringMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Sep 4, 2001·61 cites·7 claims
- 0581US4028195ARecovery of alkylene glycols by distillation with aqueous organic acidHALCON INTERNATIONAL INC·Filed 1975·Granted Jun 7, 1977·14 cites·5 claims
- 0681US2024319669A1Energy modulation systems for diffraction based holographic displaysLIGHT FIELD LAB INC·Filed 2024·Application pending·0 cites
- 0780US6537655B2Epitaxial silicon wafer with intrinsic gettering and a method for the preparation thereofMEMC ELECTRONIC MATERIALS·Filed 2001·Granted Mar 25, 2003·21 cites·6 claims
- 0879US6878039B2Polishing pad window for a chemical-mechanical polishing toolSPEEDFAM IPEC CORP·Filed 2002·Granted Apr 12, 2005·20 cites·26 claims
- 0979US6599815B1Method and apparatus for forming a silicon wafer with a denuded zoneMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Jul 29, 2003·24 cites·17 claims
- 1078US11927915B2Energy modulation systems for diffraction based holographic displaysLIGHT FIELD LAB INC·Filed 2022·Granted Mar 12, 2024·0 cites·25 claims
- 1177US6666915B2Method for the preparation of an epitaxial silicon wafer with intrinsic getteringMEMC ELECTRONIC MATERIALS·Filed 2003·Granted Dec 23, 2003·26 cites·41 claims
- 1275US8050467B2Package, packaging method and substrate thereof for sliding type thin fingerprint sensorCHIPBOND TECHNOLOGY CORP·Filed 2007·Granted Nov 1, 2011·11 cites·19 claims
- 1371US6958092B2Epitaxial silicon wafer with intrinsic gettering and a method for the preparation thereofMEMC ELECTRONIC MATERIALS·Filed 2003·Granted Oct 25, 2005·11 cites·49 claims
- 1468US10794410B1Foldable aerodynamic drag reducing plate assembly for an intermodal containerYANG CHARLES C·Filed 2019·Granted Oct 6, 2020·1 cites·3 claims
- 1558US4187153AProduction of alkylene glycolsHALCON RES & DEV·Filed 1977·Granted Feb 5, 1980·5 cites·16 claims
- 1649US10780899B1Foldable aerodynamic drag reducing plate assembly for a domestic or intermodal containerYANG CHARLES C·Filed 2019·Granted Sep 22, 2020·0 cites·4 claims
- 1745US2005026719A1Golf club head construction of the wood varietyFiled 2003·Application pending·0 cites
- 1821US2003051656A1Method for the preparation of an epitaxial silicon wafer with intrinsic getteringFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →