Inventor · disambiguated record
Kazuo Teshirogi
Also filed as: TESHIROGI KAZUO
24 granted patents·5 pending applications·523 citations·filing 2000–2015
96Inventor score
Files withFUJITSU LTD16FUJITSU SEMICONDUCTOR LTD5FUJITSU MICROELECTRONICS LTD4FUKAYA HIRONORI2MIZUKOSHI MASATAKA1
Top patents by PatentIndex Score
29 records- 0197US6388333B1Semiconductor device having protruding electrodes higher than a sealed portionFUJITSU LTD·Filed 2000·Granted May 14, 2002·285 cites·11 claims
- 0294US6824643B2Method and device of peeling semiconductor device using annular contact membersFUJITSU LTD·Filed 2002·Granted Nov 30, 2004·85 cites·2 claims
- 0392US7857140B2Semiconductor wafer storage case and semiconductor wafer storing methodFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Dec 28, 2010·20 cites·4 claims
- 0485US7479627B2Semiconductor device having transparent member and manufacturing method of the sameFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Jan 20, 2009·14 cites·11 claims
- 0585US7395847B2Jig for a semiconductor substrateFUJITSU LTD·Filed 2005·Granted Jul 8, 2008·9 cites·3 claims
- 0685US6528348B2Semiconductor device having protruding electrodes higher than a sealed portionFUJITSU LTD·Filed 2002·Granted Mar 4, 2003·36 cites·3 claims
- 0781US9010615B2Bonding apparatus and bonding methodFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Apr 21, 2015·3 cites·8 claims
- 0879US7820487B2Manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Oct 26, 2010·6 cites·17 claims
- 0978US6461942B2Semiconductor chip removing and conveying method and deviceFUJITSU LTD·Filed 2000·Granted Oct 8, 2002·24 cites·3 claims
- 1077US7485962B2Semiconductor device, wiring substrate forming method, and substrate processing apparatusFUJITSU LTD·Filed 2005·Granted Feb 3, 2009·4 cites·15 claims
- 1175US7432114B2Semiconductor device manufacturing methodFUJITSU LTD·Filed 2006·Granted Oct 7, 2008·6 cites·12 claims
- 1274US7109561B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2005·Granted Sep 19, 2006·4 cites·1 claims
- 1373US6750074B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2002·Granted Jun 15, 2004·13 cites·12 claims
- 1471US7571538B2Vacuum fixing jig for semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Aug 11, 2009·3 cites·1 claims
- 1562US8016973B2Film bonding method, film bonding apparatus, and semiconductor device manufacturing methodFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Sep 13, 2011·2 cites·5 claims
- 1659US6902944B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2004·Granted Jun 7, 2005·5 cites·4 claims
- 1758US8962470B2Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusMIZUKOSHI MASATAKA·Filed 2009·Granted Feb 24, 2015·1 cites·5 claims
- 1855US7704856B2Semiconductor device, wiring substrate forming method, and substrate processing apparatusFUJITSU LTD·Filed 2007·Granted Apr 27, 2010·0 cites·5 claims
- 1955US7648907B2Semiconductor device, wiring substrate forming method, and substrate processing apparatusFUJITSU LTD·Filed 2007·Granted Jan 19, 2010·0 cites·12 claims
- 2053US2011011919A1Bonding apparatus and bonding methodFUJITSU SEMICONDUCTOR LTD·Filed 2010·Application pending·0 cites
- 2152US2007215673A1Bonding apparatus and bonding methodFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2249US7563343B2Film lamination apparatus and method and a manufacturing method of a semiconductor apparatusFUJITSU MICROELECTRONICS LTD·Filed 2003·Granted Jul 21, 2009·2 cites·5 claims
- 2348US2015132865A1Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusFUJITSU LTD·Filed 2015·Application pending·0 cites
- 2447US2005161814A1Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2546US6951800B2Method of making semiconductor device that has improved structural strengthFUJITSU LTD·Filed 2002·Granted Oct 4, 2005·1 cites·1 claims
- 2643US2005085171A1Flat-object holder and method of using the sameFiled 2004·Application pending·0 cites
- 2742US7655505B2Manufacturing method of semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Feb 2, 2010·0 cites·5 claims
- 2839US8440545B2Method of manufacturing semiconductor device with spraying fluidFUKAYA HIRONORI·Filed 2008·Granted May 14, 2013·0 cites·14 claims
- 2926US8444799B2Method for manufacturing semiconductor device and surface protective tapeFUKAYA HIRONORI·Filed 2010·Granted May 21, 2013·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →