Inventor · disambiguated record
Seiji Muranaka
Also filed as: MURANAKA SEIJI
18 granted patents·9 pending applications·110 citations·filing 1997–2022
93Inventor score
Files withRENESAS ELECTRONICS CORP13MITSUBISHI ELECTRIC CORP8RENESAS TECH CORP2KAO CORP1MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1
Top patents by PatentIndex Score
27 records- 0192US10665502B2Semiconductor device with an interconnection layer and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted May 26, 2020·2 cites·13 claims
- 0291US11450561B2Semiconductor device with copper interconnectionsRENESAS ELECTRONICS CORP·Filed 2020·Granted Sep 20, 2022·2 cites·18 claims
- 0391US9508646B2Semicondutor device with copper plugs having different resistance valuesRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·6 cites·11 claims
- 0481US12080591B2Semiconductor device having interconnection structure and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2022·Granted Sep 3, 2024·0 cites·19 claims
- 0576US6837963B2Semiconductor device, method of producing a semiconductor device, and semiconductor substrate cleaning apparatus used for the production methodRENESAS TECH CORP·Filed 2001·Granted Jan 4, 2005·19 cites·6 claims
- 0673US9508554B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·2 cites·8 claims
- 0766US6642142B2Substrate cleaning method and method for producing an electronic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 4, 2003·11 cites·15 claims
- 0864US9576921B2Semiconductor device and manufacturing method for the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Feb 21, 2017·1 cites·19 claims
- 0962US2018240700A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1061US6586145B2Method of fabricating semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 1, 2003·8 cites·10 claims
- 1159US9972530B2Method of manufacturing semiconductor device including copper interconnectionsRENESAS ELECTRONICS CORP·Filed 2016·Granted May 15, 2018·0 cites·13 claims
- 1259US6053059AAnalyzing system of organic substance adhering to a surface of a sampleMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Apr 25, 2000·21 cites·15 claims
- 1356US6358329B1Resist residue removal apparatus and methodMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Mar 19, 2002·20 cites·16 claims
- 1452US9230909B2Semiconductor device and manufacturing method thereof, and mounting method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jan 5, 2016·0 cites·8 claims
- 1548US6713232B2Method of manufacturing semiconductor device with improved removal of resist residuesKAO CORP·Filed 2000·Granted Mar 30, 2004·2 cites·19 claims
- 1647US6340253B1Resist peeling system and control method of a resist peeling solutionMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jan 22, 2002·3 cites·13 claims
- 1745US9966455B2Method for manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted May 8, 2018·0 cites·20 claims
- 1844US2016079188A1Semiconductor device and manufacturing method thereof, and mounting method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1943US6410454B1Method and apparatus for removing contaminants from the surface of a semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jun 25, 2002·13 cites·7 claims
- 2040US6531381B2Method and apparatus for cleaning semiconductor device and method of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Mar 11, 2003·0 cites·7 claims
- 2140US2003139046A1Method and apparatus for cleaning semiconductor device and method of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 2238US2004084316A1Plating apparatus and methodRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 2338US2011254165A1Semiconductor integrated circuit device and production method thereofRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 2436US2003119331A1Method for manufacturing semiconductor deviceFiled 2002·Application pending·0 cites
- 2536US2011062539A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 2635US2002146911A1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 2732US2011298097A1Semiconductor device and method for manufacturing the sameSUEYOSHI MANABU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →