Plating apparatus and method

Abstract

It is an object to provide a plating apparatus capable of forming a plated film having a uniform thickness in a substrate to be treated. In a plating apparatus using a face down method in which a voltage is applied between a cathode electrode ( 5 ) provided in contact with a peripheral edge portion of a substrate ( 1 ) to be treated and an anode electrode ( 6 ) provided in a plating solution vessel ( 3 ), thereby carrying out plating, there is provided an anode electrode moving device ( 13 ) for vertically moving the anode electrode ( 6 ) corresponding to a plating situation of the substrate ( 1 ).

What is claimed is:  
     
         1 . A plating apparatus comprising: 
 a plating solution vessel filled with a plating solution;    an anode electrode provided in said plating solution vessel;    a holder for holding a substrate to be treated and immersing said substrate in said plating solution during plating;    a cathode electrode provided in said holder, contacting said substrate and serving to apply a voltage to said substrate; and    a moving device for controlling a distance between said anode electrode and said substrate in accordance with a thickness of plated film on said substrate.    
     
     
         2 . The plating apparatus according to  claim 1 , wherein said moving device moves said anode electrode so that said distance is smaller as said thickness of plated film on said substrate is greater.  
     
     
         3 . The plating apparatus according to  claim 1 , wherein said moving device moves said holder so that said distance is smaller as said thickness of plated film on said substrate is greater.  
     
     
         4 . The plating apparatus according to  claim 1 , wherein said anode electrode has such a shape that a thickness of a central portion is greater than that of a peripheral edge portion.  
     
     
         5 . A plating apparatus comprising: 
 a plating solution vessel filled with a plating solution;    an anode electrode provided in said plating solution vessel;    a holder for holding a substrate to be treated and immersing said substrate in said plating solution during plating;    a cathode electrode provided in said holder, contacting said substrate and serving to apply a voltage to said substrate; and    a jet nozzle for blowing off said plating solution upward from a lower part of said plating solution vessel;    a rectifying plate for controlling a flow of said plating solution blown by said jet nozzle; and    a rectifying plate moving device for moving said rectifying plate corresponding to a plating situation of said substrate.    
     
     
         6 . The plating apparatus according to  claim 5 , wherein said anode electrode has such a shape that a thickness of a central portion is greater than that of a peripheral edge portion.  
     
     
         7 . A plating method of opposing an anode electrode to a substrate to be treated which is provided in contact with a cathode electrode in a plating solution vessel filled with a plating solution, and applying a voltage between said anode electrode and said cathode electrode, thereby plating said substrate, comprising the step of: 
 changing a spacing between said anode electrode and said substrate which are opposed to each other corresponding to a thickness of plated film on said substrate.