Inventor · disambiguated record
John N. Boucher
Also filed as: BOUCHER JOHN N
13 granted patents·1 pending application·497 citations·filing 1988–2003
94Inventor score
Top patents by PatentIndex Score
14 records- 0197US5676360AMachine tool rotary table locking apparatusFiled 1995·Granted Oct 14, 1997·148 cites·17 claims
- 0293US5718615ASemiconductor wafer dicing methodFiled 1995·Granted Feb 17, 1998·86 cites·26 claims
- 0388US5934973ASemiconductor wafer dicing sawFiled 1998·Granted Aug 10, 1999·60 cites·11 claims
- 0487US6354909B1Substrate dicing methodFiled 2000·Granted Mar 12, 2002·30 cites·22 claims
- 0587US6152803ASubstrate dicing methodFiled 1999·Granted Nov 28, 2000·53 cites·32 claims
- 0680US4787362AAbrasive blade having a polycrystalline ceramic coreTHERMOCARBON INC·Filed 1988·Granted Nov 29, 1988·39 cites·20 claims
- 0774US6659843B2Substrate dicing methodFiled 2002·Granted Dec 9, 2003·14 cites·1 claims
- 0865US5819931APackage useful in storing and handling fragile dicing bladeFiled 1997·Granted Oct 13, 1998·31 cites·19 claims
- 0965US5427478ABowling ball drilling apparatusBOUCHER JOHN N·Filed 1993·Granted Jun 27, 1995·21 cites·8 claims
- 1041US2004112360A1Substrate dicing methodFiled 2003·Application pending·0 cites
- 1138US5624215ABowling ball drillingFiled 1995·Granted Apr 29, 1997·6 cites·7 claims
- 1236USD387364SSemiconductor wafer dicing sawBOUCHER JOHN N·Filed 1996·Granted Dec 9, 1997·3 cites·1 claims
- 1334US5613350AMethod for packaging and handling fragile dicing bladeFiled 1995·Granted Mar 25, 1997·6 cites·25 claims
- 1428USD381668SSemiconductor wafer dicing sawBOUCHER JOHN N·Filed 1996·Granted Jul 29, 1997·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →