USD381668SExpiredUtility

Semiconductor wafer dicing saw

28
Individually held — no corporate assignee on recordPriority: Jun 25, 1996Filed: Jun 25, 1996Granted: Jul 29, 1997
Est. expiryJun 25, 2016(expired)· nominal 20-yr term from priority
Inventors:John N. BoucherDavid E. Bajune
28
PatentIndex Score
0
Cited by
3
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a semiconductor wafer dicing saw, as shown and described.

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