Substrate dicing method

Abstract

A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center. In addition, prior to cutting along the edges of the substrate, the dicing blade is first aligned for travel parallel to and proximate the edge of the substrate, and an alignment offset is provided to the programmable dicing saw for laterally moving the blade toward the center of the substrate prior to making a cut and avoiding damage to the blade and substrate that typically results when the blade slides along the substrate edge rather than cutting into the substrate. In addition, by knowing the substrate center location, an arcuate cut can be accurately made into the substrate by making multiple straight cuts with a rotation of the substrate about its center between each cut. A flange clearance is monitored by measuring the blade exposure after a preselected number of cuts during the substrate dicing, and a minimum flange clearance permitted before blade movement toward the substrate is automatically stopped.

What is claimed is:  
     
       1. A method for dicing a substrate using a programmable dicing saw having a processor operable for movement of at least one of a spindle and a work surface, wherein movement of a dicing blade toward and away from the work surface is controlled by movements within an orthogonal coordinate system having its reference center at a center location of the work surface, the method comprising the steps of: 
       removably securing a substrate onto the work surface;  
       aligning the dicing blade with a first edge of the substrate for determining a substrate first edge location datum;  
       rotating the dicing blade relative to the substrate about an axis perpendicular thereto;  
       aligning the dicing blade with at least a second edge of the substrate for determining a substrate second edge location datum;  
       entering the edge location data representative of the substrate into the processor for determining a center location of the substrate;  
       determining a distance between the center of the substrate and the center of the work surface for providing a compensating command to the programmable dicing saw;  
       automatically positioning the dicing blade over the center of the substrate; and  
       automatically moving the spindle relative to the center of the substrate for positioning the dicing blade based on the compensating command.