Inventor · disambiguated record
Hideki Akiba
Also filed as: AKIBA HIDEKI
17 granted patents·9 pending applications·95 citations·filing 2003–2017
91Inventor score
Files withSHINETSU CHEMICAL CO26
Top patents by PatentIndex Score
26 records- 0193US7026382B2Conductive resin compositionSHINETSU CHEMICAL CO·Filed 2003·Granted Apr 11, 2006·47 cites·8 claims
- 0279US10177059B2Method for manufacturing semiconductor apparatus using a base-attached encapsulantSHINETSU CHEMICAL CO·Filed 2017·Granted Jan 8, 2019·2 cites·4 claims
- 0379US8034893B2Resin resolution composition, polyimide resin, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Granted Oct 11, 2011·9 cites·12 claims
- 0477US7683152B2Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymerSHINETSU CHEMICAL CO·Filed 2005·Granted Mar 23, 2010·4 cites·5 claims
- 0573US9865518B2Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2015·Granted Jan 9, 2018·2 cites·20 claims
- 0670US7147920B2Wafer dicing/die bonding sheetSHINETSU CHEMICAL CO·Filed 2003·Granted Dec 12, 2006·18 cites·8 claims
- 0767US7714080B2Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Granted May 11, 2010·1 cites·3 claims
- 0865US6949619B2Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin compositionSHINETSU CHEMICAL CO·Filed 2003·Granted Sep 27, 2005·11 cites·9 claims
- 0963US9449856B2Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2014·Granted Sep 20, 2016·1 cites·14 claims
- 1056US9287174B2Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2013·Granted Mar 15, 2016·0 cites·4 claims
- 1155US10242924B2Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2017·Granted Mar 26, 2019·0 cites·16 claims
- 1252US2014264956A1Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2014·Application pending·0 cites
- 1351US8872358B2Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2013·Granted Oct 28, 2014·0 cites·12 claims
- 1450US10669197B2Surface-modified glass fiber filmSHINETSU CHEMICAL CO·Filed 2014·Granted Jun 2, 2020·0 cites·10 claims
- 1549US2017282527A1Vacuum laminating apparatus and method for manufacturing semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2017·Application pending·0 cites
- 1649US2017110415A1Method for manufacturing semiconductor apparatus and semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
- 1748US9129912B2Encapsulant, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2013·Granted Sep 8, 2015·0 cites·26 claims
- 1847US2016043012A1Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2015·Application pending·0 cites
- 1947US2016141268A1Method for manufacturing semiconductor apparatus and semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2015·Application pending·0 cites
- 2045US2015235871A1Vacuum laminating apparatus and method for manufacturing semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2015·Application pending·0 cites
- 2144US9312197B2Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2015·Granted Apr 12, 2016·0 cites·20 claims
- 2244US9129976B2Method of manufacturing semiconductor apparatus and semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2013·Granted Sep 8, 2015·0 cites·13 claims
- 2342US9401290B2Semiconductor apparatus and method for producing the sameSHINETSU CHEMICAL CO·Filed 2013·Granted Jul 26, 2016·0 cites·18 claims
- 2442US2013197129A1Liquid epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2013·Application pending·0 cites
- 2536US2017098551A1Base-attached encapsulant for semiconductor encapsulation, method for manufacturing base-attached encapsulant for semiconductor encapsulation, and method for manufacturing semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
- 2633US2016044839A1Electromagnetic wave shielding sheet and semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →