Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus

Abstract

Disclosed is a sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices may be mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices may be formed, including a support wafer that may be composed of silicon and an uncured resin layer that may be constituted of an uncured thermosetting resin formed on one side of the support wafer.

What is claimed is: 
     
         1 . A sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed, comprising:
 a support wafer composed of silicon; and   an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer.   
     
     
         2 . The sealant laminated composite according to  claim 1 , wherein difference between an expansion coefficient of the support wafer and that of the substrate on which the semiconductor devices are mounted or the wafer on which the semiconductor devices are formed is 3 ppm or less. 
     
     
         3 . The sealant laminated composite according to  claim 1 , wherein a thickness of the uncured resin layer is 20 μm or more and 2000 μm or less. 
     
     
         4 . The sealant laminated composite according to  claim 2 , wherein a thickness of the uncured resin layer is 20 μm or more and 2000 μm or less. 
     
     
         5 . The sealant laminated composite according to  claim 1 , wherein the uncured resin layer contains any one of an epoxy resin, a silicone resin, and an epoxy/silicone mixed resin that solidify at less than 50° C. and melt at 50° C. or more and 150° C. or less. 
     
     
         6 . The sealant laminated composite according to  claim 2 , wherein the uncured resin layer contains any one of an epoxy resin, a silicone resin, and an epoxy/silicone mixed resin that solidify at less than 50° C. and melt at 50° C. or more and 150° C. or less. 
     
     
         7 . The sealant laminated composite according to  claim 3 , wherein the uncured resin layer contains any one of an epoxy resin, a silicone resin, and an epoxy/silicone mixed resin that solidify at less than 50° C. and melt at 50° C. or more and 150° C. or less. 
     
     
         8 . The sealant laminated composite according to  claim 4 , wherein the uncured resin layer contains anyone of an epoxy resin, a silicone resin, and an epoxy/silicone mixed resin that solidify at less than 50° C. and melt at 50° C. or more and 150° C. or less. 
     
     
         9 . A sealed semiconductor devices mounting substrate, wherein a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted is covered with the uncured resin layer of the sealant laminated composite according to  claim 1 , and the uncured resin layer is heated and cured to collectively seal the semiconductor devices mounting surface with the sealant laminated composite. 
     
     
         10 . A sealed semiconductor devices mounting substrate, wherein a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted is covered with the uncured resin layer of the sealant laminated composite according to  claim 8 , and the uncured resin layer is heated and cured to collectively seal the semiconductor devices mounting surface with the sealant laminated composite. 
     
     
         11 . A sealed semiconductor devices forming wafer, wherein a semiconductor devices forming surface of a wafer on which semiconductor devices are formed is covered with the uncured resin layer of the sealant laminated composite according to  claim 1 , and the uncured resin layer is heated and cured to collectively seal the semiconductor devices forming surface with the sealant laminated composite. 
     
     
         12 . A sealed semiconductor devices forming wafer, wherein a semiconductor devices forming surface of a wafer on which semiconductor devices are formed is covered with the uncured resin layer of the sealant laminated composite according to  claim 8 , and the uncured resin layer is heated and cured to collectively seal the semiconductor devices forming surface with the sealant laminated composite. 
     
     
         13 . A semiconductor apparatus obtained by dicing the sealed semiconductor devices mounting substrate according to  claim 9  into each piece. 
     
     
         14 . A semiconductor apparatus obtained by dicing the sealed semiconductor devices mounting substrate according to  claim 10  into each piece. 
     
     
         15 . A semiconductor apparatus obtained by dicing the sealed semiconductor devices forming wafer according to  claim 11  into each piece. 
     
     
         16 . A semiconductor apparatus obtained by dicing the sealed semiconductor devices forming wafer according to  claim 12  into each piece. 
     
     
         17 . A method for manufacturing a semiconductor apparatus, comprising the steps of:
 covering a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted, or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed with the uncured resin layer of the sealant laminated composite according to  claim 1 ;   collectively sealing the semiconductor devices mounting surface or the semiconductor devices forming surface by heating and curing the uncured resin layer to form a sealed semiconductor devices mounting substrate or a sealed semiconductor devices forming wafer; and   dicing the sealed semiconductor devices mounting substrate or the sealed semiconductor devices forming wafer into each piece to manufacture the semiconductor apparatus.   
     
     
         18 . A method for manufacturing a semiconductor apparatus, comprising the steps of:
 covering a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted, or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed with the uncured resin layer of the sealant laminated composite according to  claim 8 ;   collectively sealing the semiconductor devices mounting surface or the semiconductor devices forming surface by heating and curing the uncured resin layer to form a sealed semiconductor devices mounting substrate or a sealed semiconductor devices forming wafer; and   dicing the sealed semiconductor devices mounting substrate or the sealed semiconductor devices forming wafer into each piece to manufacture the semiconductor apparatus.