Inventor · disambiguated record
Roland R. Vandamme
Also filed as: VANDAMME ROLAND · VANDAMME ROLAND R
19 granted patents·9 pending applications·268 citations·filing 1993–2014
94Inventor score
Files withMEMC ELECTRONIC MATERIALS8ZAVATTARI CARLO5ZHANG GUOQIANG DAVID3BHAGAVAT MILIND S2BHAGAVAT SUMEET S2
Top patents by PatentIndex Score
28 records- 0194US7930058B2Nanotopography control and optimization using feedback from warp dataMEMC ELECTRONIC MATERIALS·Filed 2007·Granted Apr 19, 2011·28 cites·19 claims
- 0289US7927185B2Method for assessing workpiece nanotopology using a double side wafer grinderMEMC ELECTRONIC MATERIALS·Filed 2009·Granted Apr 19, 2011·12 cites·11 claims
- 0388US7601049B2Double side wafer grinder and methods for assessing workpiece nanotopologyMEMC ELECTRONIC MATERIALS·Filed 2006·Granted Oct 13, 2009·15 cites·28 claims
- 0485US8145342B2Methods and systems for adjusting operation of a wafer grinder using feedback from warp dataBHAGAVAT SUMEET S·Filed 2010·Granted Mar 27, 2012·8 cites·34 claims
- 0585US5340437AProcess and apparatus for etching semiconductor wafersMEMC ELECTRONIC MATERIALS·Filed 1993·Granted Aug 23, 1994·88 cites·21 claims
- 0684US8712575B2Hydrostatic pad pressure modulation in a simultaneous double side wafer grinderBHAGAVAT SUMEET S·Filed 2011·Granted Apr 29, 2014·8 cites·10 claims
- 0781US7878883B2Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate controlMEMC ELECTRONICS MATERIALS INC·Filed 2007·Granted Feb 1, 2011·10 cites·17 claims
- 0879US9601395B2Methods for post-epitaxial warp prediction and controlSUNEDISON SEMICONDUCTOR LTD (UEN201334164H)·Filed 2012·Granted Mar 21, 2017·4 cites·11 claims
- 0977US9566687B2Center flex single side polishing head having recess and capSUNEDISON SEMICONDUCTOR LTD (UEN201334164H)·Filed 2014·Granted Feb 14, 2017·4 cites·22 claims
- 1076US8267745B2Methods of grinding semiconductor wafers having improved nanotopologyBHAGAVAT MILIND S·Filed 2010·Granted Sep 18, 2012·3 cites·10 claims
- 1169US7559825B2Method of polishing a semiconductor waferMEMC ELECTRONIC MATERIALS·Filed 2006·Granted Jul 14, 2009·5 cites·21 claims
- 1267US6200908B1Process for reducing waviness in semiconductor wafersMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Mar 13, 2001·38 cites·22 claims
- 1365US8066553B2Wafer clamping device for a double side grinderBHAGAVAT MILIND S·Filed 2005·Granted Nov 29, 2011·2 cites·14 claims
- 1464US7416962B2Method for processing a semiconductor wafer including back side grindingSILTRONIC CORP·Filed 2002·Granted Aug 26, 2008·13 cites·23 claims
- 1560US6114245AMethod of processing semiconductor wafersMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Sep 5, 2000·28 cites·17 claims
- 1659US8309464B2Methods for etching the edge of a silicon waferERK HENRY F·Filed 2009·Granted Nov 13, 2012·1 cites·45 claims
- 1759US8192822B2Edge etched silicon wafersERK HENRY F·Filed 2009·Granted Jun 5, 2012·1 cites·21 claims
- 1847US9156187B2Methods for mounting an ingot on a wire sawMEMC ELECTRONIC MATERIALS·Filed 2012·Granted Oct 13, 2015·0 cites·18 claims
- 1946US2014357161A1Center flex single side polishing headSUNEDISON SEMICONDUCTOR LTD·Filed 2014·Application pending·0 cites
- 2045US2013206163A1Methods and Systems For Removing Contaminants From A Wire Of A SawZAVATTARI CARLO·Filed 2012·Application pending·0 cites
- 2141US2013174828A1Systems and Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire SawMEMC ELECTRONIC MATERIALS SPA·Filed 2012·Application pending·0 cites
- 2238US2013139801A1Methods For Controlling Displacement Of Bearings In A Wire SawZAVATTARI CARLO·Filed 2011·Application pending·0 cites
- 2338US2013139800A1Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire SawZAVATTARI CARLO·Filed 2011·Application pending·0 cites
- 2438US2013144421A1Systems For Controlling Temperature Of Bearings In A Wire SawZAVATTARI CARLO·Filed 2011·Application pending·0 cites
- 2536US2013144420A1Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire SawZAVATTARI CARLO·Filed 2011·Application pending·0 cites
- 2635US8310031B2Semiconductor and solar wafersZHANG GUOQIANG DAVID·Filed 2010·Granted Nov 13, 2012·0 cites·19 claims
- 2735US2012028555A1Grinding Tool For Trapezoid Grinding Of A WaferZHANG GUOQIANG DAVID·Filed 2010·Application pending·0 cites
- 2830US2012028439A1Semiconductor And Solar Wafers And Method For Processing SameZHANG GUOQIANG DAVID·Filed 2010·Application pending·0 cites
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