Grinding Tool For Trapezoid Grinding Of A Wafer

Abstract

A grinding tool for trapezoid grinding of a wafer on a profiling machine includes an annular wheel including a central hole adapted for mounting the wheel on a spindle. The wheel includes at least two grooves disposed at an outer edge of the wheel and the grooves are sized for receiving an outer edge of the wafer. At least one of the grooves is adapted for rough grinding of the wafer. At least one other of the grooves is adapted for fine grinding of the wafer.

1 . A grinding tool for trapezoid grinding of a wafer on a profiling machine, the tool comprising:
 an annular wheel including a central hole adapted for mounting the wheel on a spindle,   the wheel including at least two grooves disposed at an outer edge of the wheel, the grooves sized for receiving an outer edge of the wafer,   at least one of the grooves adapted for rough grinding of the wafer,   at least one other of the grooves adapted for fine grinding of the wafer.   
     
     
         2 . The grinding tool of  claim 1  wherein each groove is angled such that an upper peripheral edge of the wafer is ground and so that a lower peripheral edge of the wafer is not ground. 
     
     
         3 . The grinding tool of  claim 2  wherein the groove has an angle between about 3° and 10° and wherein the groove has a flat bottom so that only the upper peripheral edge of the wafer is ground. 
     
     
         4 . The grinding tool of  claim 2  wherein each groove has a V-shape in cross-section sized so that only the upper peripheral edge of the wafer is ground. 
     
     
         5 . The grinding tool of  claim 1  wherein the at least two grooves are disposed adjacent one another so that the wafer can be readily moved from groove to groove. 
     
     
         6 . The grinding tool of  claim 1  wherein the groove for rough grinding has a diamond grit size of about 600 to about 800 mesh, and the groove for fine grinding has a diamond grit size of about 2000 to about 3000 mesh. 
     
     
         7 . The grinding tool of  claim 1  wherein the wheel includes two grooves for fine grinding and one groove for rough grinding. 
     
     
         8 . A grinding tool for grinding of a wafer on a profiling machine, the tool comprising:
 an annular wheel including a central hole adapted for mounting the wheel on a spindle,   the wheel including three or more grooves disposed at an outer edge of the wheel, the grooves sized for receiving an outer edge of the wafer,   at least one of the grooves adapted for rough grinding of the wafer,   at least one other of the grooves adapted for fine grinding of the wafer, and   each groove sized and shaped so that only the upper peripheral edge of the wafer is ground.   
     
     
         9 . The grinding tool of  claim 8  wherein each groove is angled such that an upper peripheral edge of the wafer is ground and so that a lower peripheral edge of the wafer is not ground. 
     
     
         10 . The grinding tool of  claim 9  wherein the groove has an angle of about 7° and wherein the groove has a flat bottom so that only the upper peripheral edge of the wafer is ground. 
     
     
         11 . The grinding tool of  claim 10  wherein each groove has a V-shape in cross-section. 
     
     
         12 . The grinding tool of  claim 11  wherein the grooves are disposed adjacent one another so that the wafer can be quickly moved from groove to groove. 
     
     
         13 . The grinding tool of  claim 1  wherein the groove for rough grinding has a diamond grit size of about 600 to about 800 mesh, and the groove for fine grinding has a diamond grit size of about 2000 to about 3000 mesh. 
     
     
         14 . The grinding tool of  claim 13  wherein the wheel includes two grooves for fine grinding and one groove for rough grinding. 
     
     
         15 . A grinding tool for grinding of a wafer on a profiling machine, the tool comprising:
 an annular wheel including a central hole adapted for mounting the wheel on a spindle,   the wheel including three or more grooves disposed at an outer edge of the wheel, the grooves sized for receiving an outer edge of the wafer,   one groove for rough grinding of the wafer,   at least two grooves for fine grinding of the wafer, and   each groove having a V-shape in cross-section and sized relative to the wafer so that only the upper peripheral edge of the wafer is ground.   
     
     
         16 . The grinding tool of  claim 15  wherein the groove has an angle of about 7° and wherein the groove is a flat bottomed V-shape so that only the upper peripheral edge of the wafer is ground. 
     
     
         17 . The grinding tool of  claim 16  wherein the grooves are disposed adjacent one another so that the wafer can be quickly moved from groove to groove. 
     
     
         18 . The grinding tool of  claim 17  wherein the groove for rough grinding has a diamond grit size of about 600 to about 800 mesh, and the groove for fine grinding has a diamond grit size of about 2000 to about 3000 mesh.