Individual holder
BHAGAVAT MILIND S
US·7 granted patents·62 citations·filing 2005–2018
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
7 records- 0197US10510721B2Molded chip combinationBHAGAVAT MILIND S·Filed 2017·Granted Dec 17, 2019·32 cites·20 claims
- 0296US10593628B2Molded die last chip combinationBHAGAVAT MILIND S·Filed 2018·Granted Mar 17, 2020·15 cites·20 claims
- 0389US10714462B2Multi-chip package with offset 3D structureBHAGAVAT MILIND S·Filed 2018·Granted Jul 14, 2020·5 cites·20 claims
- 0479US10672712B2Multi-RDL structure packages and methods of fabricating the sameBHAGAVAT MILIND S·Filed 2018·Granted Jun 2, 2020·2 cites·21 claims
- 0576US8267745B2Methods of grinding semiconductor wafers having improved nanotopologyBHAGAVAT MILIND S·Filed 2010·Granted Sep 18, 2012·3 cites·10 claims
- 0670US9123698B2Flexural plate wave device for chip coolingBHAGAVAT MILIND S·Filed 2011·Granted Sep 1, 2015·3 cites·22 claims
- 0765US8066553B2Wafer clamping device for a double side grinderBHAGAVAT MILIND S·Filed 2005·Granted Nov 29, 2011·2 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when BHAGAVAT MILIND S files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →