Inventor · disambiguated record
Daniel A. Steigerwald
Also filed as: MARTIN PAUL SCOTT · STEIGERWALD DANIEL A · STEIGERWALD DANIEL ALEXANDER
34 granted patents·4 pending applications·2,464 citations·filing 1997–2017
98Inventor score
Files withLUMILEDS LIGHTING LLC20PHILIPS LUMILEDS LIGHTING CO6KONINKLIJKE PHILIPS NV5BHAT JEROME CHANDRA2STEIGERWALD DANIEL ALEXANDER2
Top patents by PatentIndex Score
38 records- 0199US6784463B2III-Phospide and III-Arsenide flip chip light-emitting devicesLUMILEDS LIGHTING LLC·Filed 2002·Granted Aug 31, 2004·453 cites·56 claims
- 0298US7048412B2Axial LED sourceLUMILEDS LIGHTING LLC·Filed 2002·Granted May 23, 2006·182 cites·40 claims
- 0398US6828596B2Contacting scheme for large and small area semiconductor light emitting flip chip devicesLUMILEDS LIGHTING LLC·Filed 2002·Granted Dec 7, 2004·175 cites·28 claims
- 0498US6547249B2Monolithic series/parallel led arrays formed on highly resistive substratesLUMILEDS LIGHTING LLC·Filed 2001·Granted Apr 15, 2003·428 cites·24 claims
- 0597US7348212B2Interconnects for semiconductor light emitting devicesPHILIPS LUMILEDS LIGHTING CO·Filed 2005·Granted Mar 25, 2008·62 cites·20 claims
- 0697US6455878B1Semiconductor LED flip-chip having low refractive index underfillLUMILEDS LIGHTING LLC·Filed 2001·Granted Sep 24, 2002·161 cites·24 claims
- 0796US6885035B2Multi-chip semiconductor LED assemblyLUMILEDS LIGHTING LLC·Filed 2001·Granted Apr 26, 2005·212 cites·16 claims
- 0895US6844571B2III-nitride light-emitting device with increased light generating capabilityLUMILEDS LIGHTING LLC·Filed 2002·Granted Jan 18, 2005·76 cites·36 claims
- 0995US6630689B2Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesaLUMILEDS LIGHTING LLC·Filed 2001·Granted Oct 7, 2003·93 cites·15 claims
- 1094US6946309B2III-Phosphide and III-Arsenide flip chip light-emitting devicesLUMILEDS LIGHTING LLC·Filed 2004·Granted Sep 20, 2005·67 cites·5 claims
- 1194US6914272B2Formation of Ohmic contacts in III-nitride light emitting devicesLUMILEDS LIGHTING LLC·Filed 2003·Granted Jul 5, 2005·40 cites·13 claims
- 1294US6891197B2Semiconductor LED flip-chip with dielectric coating on the mesaLUMILEDS LIGHTING LLC·Filed 2003·Granted May 10, 2005·82 cites·14 claims
- 1394US6730940B1Enhanced brightness light emitting device spot emitterLUMILEDS LIGHTING LLC·Filed 2002·Granted May 4, 2004·123 cites·21 claims
- 1493US6657300B2Formation of ohmic contacts in III-nitride light emitting devicesLUMILEDS LIGHTING LLC·Filed 2001·Granted Dec 2, 2003·37 cites·9 claims
- 1591US7345323B2Formation of Ohmic contacts in III-nitride light emitting devicesPHILIPS LUMILEDS LIGHTING CO·Filed 2005·Granted Mar 18, 2008·14 cites·11 claims
- 1690US7095061B2Contacting scheme for large and small area semiconductor light emitting flip chip devicesPHILIPS LUMILEDS LIGHTING CO·Filed 2004·Granted Aug 22, 2006·47 cites·13 claims
- 1789US7652304B2Contacting scheme for large and small area semiconductor light emitting flip chip devicesPHILIPS LUMILEDS LIGHTING CO·Filed 2006·Granted Jan 26, 2010·14 cites·19 claims
- 1886US6977396B2High-powered light emitting device with improved thermal propertiesLUMILEDS LIGHTING LLC·Filed 2003·Granted Dec 20, 2005·41 cites·23 claims
- 1985US7351599B2High-powered light emitting device with improved thermal propertiesPHILIPS LUMILEDS LIGHTING CO·Filed 2005·Granted Apr 1, 2008·12 cites·5 claims
- 2085US6946685B1Light emitting semiconductor method and deviceLUMILEDS LIGHTING LLC·Filed 2000·Granted Sep 20, 2005·42 cites·35 claims
- 2181US6933535B2Light emitting devices with enhanced luminous efficiencyLUMILEDS LIGHTING LLC·Filed 2003·Granted Aug 23, 2005·33 cites·21 claims
- 2279US9153758B2Method of attaching a light emitting device to a support substrateSTEIGERWALD DANIEL ALEXANDER·Filed 2012·Granted Oct 6, 2015·4 cites·15 claims
- 2370US7015054B2Semiconductor light emitting device and methodLUMILEDS LIGHTING LLC·Filed 2003·Granted Mar 21, 2006·16 cites·13 claims
- 2466US9219209B2P-N separation metal fill for flip chip LEDsLEI JIPU·Filed 2012·Granted Dec 22, 2015·2 cites·20 claims
- 2566US6756186B2Producing self-aligned and self-exposed photoresist patterns on light emitting devicesLUMILEDS LIGHTING LLC·Filed 2002·Granted Jun 29, 2004·15 cites·20 claims
- 2665US8951817B2Light emitting device chip scale packageSTEIGERWALD DANIEL ALEXANDER·Filed 2011·Granted Feb 10, 2015·2 cites·21 claims
- 2763US5909051AMinority carrier semiconductor devices with improved stabilityHEWLETT PACKARD CO·Filed 1997·Granted Jun 1, 1999·30 cites·11 claims
- 2856US10170675B2P—N separation metal fill for flip chip LEDsLUMILEDS LLC·Filed 2017·Granted Jan 1, 2019·0 cites·20 claims
- 2954US9705047B2Method of attaching a light emitting device to a support substrateKONINKLIJKE PHILIPS NV·Filed 2016·Granted Jul 11, 2017·0 cites·15 claims
- 3054US9431581B2Method of attaching a light emitting device to a support substrateKONINKLIJKE PHILIPS NV·Filed 2015·Granted Aug 30, 2016·0 cites·16 claims
- 3152US9722137B2LED having vertical contacts redistributed for flip chip mountingKONINKLIJKE PHILIPS NV·Filed 2016·Granted Aug 1, 2017·0 cites·6 claims
- 3252US9722161B2P-n separation metal fill for flip chip LEDsKONINKLIJKE PHILIPS NV·Filed 2015·Granted Aug 1, 2017·0 cites·19 claims
- 3352US2018019370A1Led having vertical contacts redistributed for flip chip mountingKONINKLIJKE PHILIPS NV·Filed 2017·Application pending·0 cites
- 3450US2008142833A1Interconnects for semiconductor light emitting devicesPHILIPS LUMILEDS LIGHTING CO·Filed 2008·Application pending·0 cites
- 3539US10056531B2Method of processing a semiconductor structureBHAT JEROME CHANDRA·Filed 2012·Granted Aug 21, 2018·0 cites·12 claims
- 3639US2005179041A1Illumination system with LEDsLUMILEDS LIGHTING LLC·Filed 2004·Application pending·0 cites
- 3734US2014077246A1Light emitting device bonded to a support substrateBHAT JEROME CHANDRA·Filed 2012·Application pending·0 cites
- 3831US6794731B2Minority carrier semiconductor devices with improved reliabilityLUMILEDS LIGHTING LLC·Filed 1998·Granted Sep 21, 2004·1 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →