Inventor · disambiguated record
Jipu Lei
Also filed as: LEI JIPU
12 granted patents·2 pending applications·15 citations·filing 2004–2018
85Inventor score
Top patents by PatentIndex Score
14 records- 0179US9246061B2LED having vertical contacts redistruted for flip chip mountingLEI JIPU·Filed 2012·Granted Jan 26, 2016·6 cites·9 claims
- 0271US9324927B2Semiconductor light emitting device with thick metal layersKONINKL PHILIPS NV·Filed 2012·Granted Apr 26, 2016·1 cites·17 claims
- 0366US9219209B2P-N separation metal fill for flip chip LEDsLEI JIPU·Filed 2012·Granted Dec 22, 2015·2 cites·20 claims
- 0462US10020431B2Sealed semiconductor light emitting deviceKONINKLIJKE PHILIPS NV·Filed 2013·Granted Jul 10, 2018·1 cites·24 claims
- 0560US9484513B2Semiconductor light emitting device with thick metal layersKONINKLIJKE PHILIPS NV·Filed 2016·Granted Nov 1, 2016·0 cites·19 claims
- 0659US9406857B2Chip scale light emitting device with metal pillars in a molding compound formed at wafer levelKONINKLIJKE PHILIPS NV·Filed 2013·Granted Aug 2, 2016·1 cites·12 claims
- 0756US10170675B2P—N separation metal fill for flip chip LEDsLUMILEDS LLC·Filed 2017·Granted Jan 1, 2019·0 cites·20 claims
- 0852US9722137B2LED having vertical contacts redistributed for flip chip mountingKONINKLIJKE PHILIPS NV·Filed 2016·Granted Aug 1, 2017·0 cites·6 claims
- 0952US9722161B2P-n separation metal fill for flip chip LEDsKONINKLIJKE PHILIPS NV·Filed 2015·Granted Aug 1, 2017·0 cites·19 claims
- 1052US2018019370A1Led having vertical contacts redistributed for flip chip mountingKONINKLIJKE PHILIPS NV·Filed 2017·Application pending·0 cites
- 1151US2018323353A1Sealed semiconductor light emitting deviceLUMILEDS LLC·Filed 2018·Application pending·0 cites
- 1247US7534967B2Conductor structures including penetrable materialsUNIV NORTH TEXAS·Filed 2004·Granted May 19, 2009·4 cites·5 claims
- 1343US9935069B2Reducing solder pad topology differences by planarizationLUMILEDS LLC·Filed 2014·Granted Apr 3, 2018·0 cites·11 claims
- 1443US9608016B2Method of separating a wafer of semiconductor devicesKONINKLIJKE PHILIPS NV·Filed 2013·Granted Mar 28, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →