Inventor · disambiguated record
J. Michael Brooks
Also filed as: BROOKS J M · BROOKS J MICHAEL
23 granted patents·3 pending applications·149 citations·filing 1998–2019
95Inventor score
Top patents by PatentIndex Score
26 records- 0198US9362208B2Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2015·Granted Jun 7, 2016·19 cites·22 claims
- 0297US7910385B2Method of fabricating microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 22, 2011·54 cites·17 claims
- 0390US7655500B2Packaged microelectronic devices and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted Feb 2, 2010·14 cites·22 claims
- 0487US8138021B2Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor componentsCORISIS DAVID J·Filed 2010·Granted Mar 20, 2012·9 cites·21 claims
- 0585US7750449B2Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 6, 2010·8 cites·15 claims
- 0685US7329949B2Packaged microelectronic devices and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 12, 2008·9 cites·23 claims
- 0782US9960094B2Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2016·Granted May 1, 2018·2 cites·11 claims
- 0882US7759785B2Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 20, 2010·10 cites·18 claims
- 0982US7550847B2Packaged microelectronic devices and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Jun 23, 2009·7 cites·19 claims
- 1068US7955898B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Jun 7, 2011·2 cites·12 claims
- 1163US10763185B2Packaged semiconductor components having substantially rigid support membersMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 1, 2020·0 cites·11 claims
- 1262US10692827B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 23, 2020·0 cites·9 claims
- 1361US10312173B2Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 4, 2019·0 cites·10 claims
- 1461US8138613B2Microelectronic devicesKWEON YOUNG DO·Filed 2011·Granted Mar 20, 2012·1 cites·31 claims
- 1559US10163826B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·0 cites·9 claims
- 1659US9812415B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted Nov 7, 2017·0 cites·8 claims
- 1753US7253025B2Multiple substrate microelectronic devices and methods of manufactureMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 7, 2007·4 cites·44 claims
- 1851US2010255636A1Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2010·Application pending·0 cites
- 1950US2006201705A1Electrical device allowing for increased device densitiesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2047US6914198B2Electrical device allowing for increased device densitiesMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 5, 2005·1 cites·10 claims
- 2147US6909055B2Electrical device allowing for increased device densitiesMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 21, 2005·1 cites·45 claims
- 2246US8866272B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesSCHWAB MATT E·Filed 2011·Granted Oct 21, 2014·0 cites·12 claims
- 2346US6535393B2Electrical device allowing for increased device densitiesMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 18, 2003·8 cites·23 claims
- 2445US2009146234A1Microelectronic imaging units having an infrared-absorbing layer and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 2541US7084351B2Electrical device allowing for increased device densitiesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 1, 2006·0 cites·24 claims
- 2639US7298031B1Multiple substrate microelectronic devices and methods of manufactureMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 20, 2007·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →