Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Abstract

Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

1 . A method for processing semiconductor wafer, comprising:
 forming integrated circuits on a semiconductor wafer;   removing material from a surface of the semiconductor wafer;   attaching a support structure to the semiconductor wafer, the support structure being at least substantially rigid;   cutting the semiconductor wafer and the support structure into individual dies with support members attached to the dies after the support structure is attached to the semiconductor wafer, individual support members being a portion of the semiconductor structure; and   packaging individual dies and the attached support member into a semiconductor component.   
     
     
         2 . The method of  claim 1 , further comprising pre-forming the support structure and at least one adhesive into a die attach film, and wherein attaching a support structure includes attaching the die attach film with the at least one adhesive facing the semiconductor wafer. 
     
     
         3 . The method of  claim 1  wherein attaching a support structure includes attaching a metal or metal alloy plate to the semiconductor wafer. 
     
     
         4 . The method of  claim 1  wherein attaching a support structure includes attaching a laminated structure to the semiconductor wafer, the laminated structure having at least one substantially rigid layer. 
     
     
         5 . The method of  claim 1  wherein cutting the semiconductor wafer includes cutting the semiconductor wafer and the support structure into subassemblies, individual subassemblies having a die and a support member that is a portion of the support structure. 
     
     
         6 . The method of  claim 1  wherein cutting the semiconductor wafer includes imparting rigidity to the semiconductor wafer with the attached support structure during cutting. 
     
     
         7 . The method of  claim 1  wherein cutting the semiconductor wafer includes reducing flexing of the semiconductor wafer during cutting with the attached support structure. 
     
     
         8 . A method for assembling a packaged semiconductor component, comprising:
 attaching a semiconductor die and a support member to a substrate, the support member being at least substantially rigid and having a composition different from a composition of the semiconductor die;   electrically connecting individual bond pads at the semiconductor die to individual connection sites at the substrate; and   encasing the semiconductor die and the support member in an encapsulant.   
     
     
         9 . The method of  claim 8  wherein attaching a semiconductor die and a support member includes attaching a semiconductor die, a support member, and an adhesive to a substrate, the adhesive attaching the support member to the semiconductor die. 
     
     
         10 . The method of  claim 8  wherein attaching a semiconductor die and a support member includes attaching a semiconductor die having a first surface and a second surface opposite the first surface, a support member, and an adhesive attaching the support member to the second surface of the semiconductor die to a substrate, the semiconductor die having a plurality of bond pads at the first surface of the semiconductor die. 
     
     
         11 . The method of  claim 8  wherein attaching a semiconductor die and a support member includes attaching a semiconductor die having a first surface and a second surface opposite the first surface and a support member to a substrate, the semiconductor die having a plurality of bond pads at the first surface of the semiconductor die and the support member having an opening generally corresponding to the plurality of bond pads. 
     
     
         12 . The method of  claim 8  wherein attaching a semiconductor die and a support member includes attaching a semiconductor die having a first surface and a second surface opposite the first surface and a support member to a substrate, and wherein the method further includes disposing a plurality of solder balls between the first surface of the semiconductor die and the substrate. 
     
     
         13 . The method of  claim 8  wherein the semiconductor die is a first semiconductor die, and wherein the method further includes:
 disposing a second semiconductor die on the substrate; and   separating the first and second semiconductor dies with the support member.   
     
     
         14 . The method of  claim 13  wherein individual first and second semiconductor dies include a plurality of bond pads at or near a surface of the first and second dies, and wherein the method further includes allowing the bond pads of the first and second dies to be wirebonded to connection sites at the substrate.