Electrical device allowing for increased device densities

Abstract

A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate. Also disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.

1 - 29 . (canceled)  
   
   
       30 . A circuit board, comprising: 
 a substrate;    a mechanically deformable structure attached to the substrate; and    a device secured to the substrate via the mechanically deformable structure, wherein the device comprises at least one lead attached to the mechanically deformable structure.    
   
   
       31 . The circuit board of  claim 30 , wherein the device further comprises a circuit connected to the at least one lead.  
   
   
       32 . The circuit board of  claim 30 , wherein the substrate comprises at least one non-uniform portion.  
   
   
       33 . The circuit board of  claim 30 , wherein the mechanically deformable structure is resilient.  
   
   
       34 . The circuit board of  claim 30 , further comprising a conductor connected to the mechanically deformable structure.  
   
   
       35 . The circuit board of  claim 30 , further comprising an adhesive for attaching the mechanically deformable structure to the substrate and the lead.  
   
   
       36 . The circuit board of  claim 35 , wherein the mechanically deformable structure and the adhesive are electrically conductive.  
   
   
       37 . The circuit board of  claim 35 , wherein at least one of the mechanically deformable structure and the adhesive is electrically non-conductive.  
   
   
       38 . The circuit board of  claim 30 , further comprising a second mechanically deformable structure attached to the substrate and to at least one lead of the device.  
   
   
       39 . A circuit board, comprising: 
 a substrate; and    a mechanically deformable structure adhered to the substrate.    
   
   
       40 . The circuit board of  claim 39 , further comprising a device having at least one lead adhered to the mechanically deformable structure.  
   
   
       41 . The circuit board of  claim 40 , wherein the device further comprises a circuit connected to the at least one lead.  
   
   
       42 . The circuit board of  claim 39 , wherein the substrate comprises at least one non-uniform portion.  
   
   
       43 . The circuit board of  claim 39 , wherein the mechanically deformable structure is resilient.  
   
   
       44 . The circuit board of  claim 39 , further comprising a conductor connected to the mechanically deformable structure.  
   
   
       45 . The circuit board of  claim 39 , wherein the mechanically deformable structure is conductive.  
   
   
       46 . The circuit board of  claim 39 , wherein the mechanically deformable structure is non-conductive.  
   
   
       47 . The circuit board of  claim 40 , further comprising a second mechanically deformable structure adhered to the substrate and to at least one lead of the device.