Inventor · disambiguated record
Roger Alan Lindley
Also filed as: LINDLEY ROGER · LINDLEY ROGER A · LINDLEY ROGER ALAN
23 granted patents·3 pending applications·979 citations·filing 1997–2023
96Inventor score
Files withAPPLIED MATERIALS INC21APPLLIED MATERIALS INC1HARDY CHARLES1HOFFMAN DANIEL J1LINDLEY ROGER ALAN1
Top patents by PatentIndex Score
26 records- 0198US10763150B2System for coupling a voltage to spatially segmented portions of the wafer with variable voltageAPPLIED MATERIALS INC·Filed 2017·Granted Sep 1, 2020·42 cites·20 claims
- 0298US8382939B2Plasma processing chamber with enhanced gas deliveryAPPLIED MATERIALS INC·Filed 2009·Granted Feb 26, 2013·403 cites·12 claims
- 0397US10688750B2Bonding structure of E chuck to aluminum base configurationAPPLIED MATERIALS INC·Filed 2017·Granted Jun 23, 2020·13 cites·20 claims
- 0494US8617351B2Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reductionHOFFMAN DANIEL J·Filed 2005·Granted Dec 31, 2013·26 cites·10 claims
- 0594US8092605B2Magnetic confinement of a plasmaSHANNON STEVEN C·Filed 2006·Granted Jan 10, 2012·37 cites·22 claims
- 0692US6113731AMagnetically-enhanced plasma chamber with non-uniform magnetic fieldAPPLIED MATERIALS INC·Filed 1997·Granted Sep 5, 2000·152 cites·42 claims
- 0791US6326307B1Plasma pretreatment of photoresist in an oxide etch processAPPLLIED MATERIALS INC·Filed 1999·Granted Dec 4, 2001·201 cites·28 claims
- 0887US7879186B2Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactorAPPLIED MATERIALS INC·Filed 2008·Granted Feb 1, 2011·7 cites·8 claims
- 0984US11192323B2Bonding structure of e chuck to aluminum base configurationAPPLIED MATERIALS INC·Filed 2020·Granted Dec 7, 2021·1 cites·20 claims
- 1083US7972469B2Plasma processing apparatusAPPLIED MATERIALS INC·Filed 2007·Granted Jul 5, 2011·7 cites·23 claims
- 1183US7374636B2Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactorAPPLIED MATERIALS INC·Filed 2002·Granted May 20, 2008·21 cites·16 claims
- 1281US8048328B2Method for shaping a magnetic field in a magnetic field-enhanced plasma reactorAPPLIED MATERIALS INC·Filed 2006·Granted Nov 1, 2011·7 cites·25 claims
- 1379US10153139B2Multiple electrode substrate support assembly and phase control systemAPPLIED MATERIALS INC·Filed 2015·Granted Dec 11, 2018·2 cites·19 claims
- 1479US7422654B2Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactorAPPLIED MATERIALS INC·Filed 2004·Granted Sep 9, 2008·11 cites·35 claims
- 1575US11794441B2Bonding structure of e chuck to aluminum base configurationAPPLIED MATERIALS INC·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 1672US7883633B2Method for shaping a magnetic field in a magnetic field-enhanced plasma reactorAPPLIED MATERIALS INC·Filed 2006·Granted Feb 8, 2011·3 cites·19 claims
- 1771US7316199B2Method and apparatus for controlling the magnetic field intensity in a plasma enhanced semiconductor wafer processing chamberAPPLIED MATERIALS INC·Filed 2002·Granted Jan 8, 2008·9 cites·11 claims
- 1870US5989349ADiagnostic pedestal assembly for a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1997·Granted Nov 23, 1999·36 cites·41 claims
- 1968US8527081B2Method and apparatus for automated validation of semiconductor process recipesHARDY CHARLES·Filed 2011·Granted Sep 3, 2013·1 cites·20 claims
- 2067US12504726B2Determining equipment constant updates by machine learningAPPLIED MATERIALS INC·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 2164US12498705B2Chamber matching by equipment constant updatesAPPLIED MATERIALS INC·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 2258US2018366306A1Multiple electrode substrate support assembly and phase control systemAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2355US2024329626A1Digital simulation for semiconductor manufacturing processesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2454US12444655B2Machine learning model for semiconductor manufacturing processesAPPLIED MATERIALS INC·Filed 2023·Granted Oct 14, 2025·0 cites·25 claims
- 2550US2008260966A1Plasma processing methodAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2648US8936696B2Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactorLINDLEY ROGER ALAN·Filed 2011·Granted Jan 20, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →