Inventor · disambiguated record
Tetsuya Kurokawa
Also filed as: KUROKAWA TETSUYA
7 granted patents·4 pending applications·334 citations·filing 1996–2009
88Inventor score
Top patents by PatentIndex Score
11 records- 0191US5844306ADie pad structure for solder bondingMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 1, 1998·204 cites·34 claims
- 0287US7388291B2Semiconductor device and method of fabricating the sameNEC ELECTRONICS CORP·Filed 2005·Granted Jun 17, 2008·11 cites·5 claims
- 0378US7138700B2Semiconductor device with guard ring for preventing water from entering circuit region from outsideNEC ELECTRONICS CORP·Filed 2004·Granted Nov 21, 2006·26 cites·18 claims
- 0466US6010666ADeodorizing method, deodorizer, method of manufacturing deodorizer, and deodorizing apparatusTOTO LTD·Filed 1996·Granted Jan 4, 2000·58 cites·18 claims
- 0564US7230337B2Semiconductor device including ladder-shaped siloxane hydride and method for manufacturing sameNEC ELECTRONICS CORP·Filed 2004·Granted Jun 12, 2007·9 cites·8 claims
- 0662US7800229B2Semiconductor device and method for manufacturing sameNEC ELECTRONICS CORP·Filed 2007·Granted Sep 21, 2010·2 cites·6 claims
- 0762US6207106B1Room temperature deodorizing method based on a polymerization reaction, an oxidation reaction and adsorptionTOTO LTD·Filed 1999·Granted Mar 27, 2001·24 cites·12 claims
- 0853US2008203572A1Semiconductor device and method of fabricating the sameNEC ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 0948US2006276029A1Semiconductor device and method for manufacturing sameNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 1046US2010078820A1Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1139US2008029402A1Electrochemical processing apparatus and method of processing a semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →