Inventor · disambiguated record
Takeo Katoh
Also filed as: KATOH TAKEO
14 granted patents·13 pending applications·67 citations·filing 2003–2014
89Inventor score
Top patents by PatentIndex Score
27 records- 0181US8379196B2Method for judging whether semiconductor wafer is non-defective wafer by using laser scattering methodSUMCO CORP·Filed 2010·Granted Feb 19, 2013·4 cites·2 claims
- 0281US7491342B2Bonded semiconductor substrate manufacturing method thereofSUMCO CORP·Filed 2004·Granted Feb 17, 2009·33 cites·6 claims
- 0381US7488400B2Apparatus for etching wafer by single-wafer processSUMCO CORP·Filed 2006·Granted Feb 10, 2009·7 cites·7 claims
- 0477US7601644B2Method for manufacturing silicon wafersSUMCO CORP·Filed 2005·Granted Oct 13, 2009·6 cites·4 claims
- 0576US7906438B2Single wafer etching methodSUMCO CORP·Filed 2007·Granted Mar 15, 2011·5 cites·5 claims
- 0667US8466071B2Method for etching single waferKOYATA SAKAE·Filed 2007·Granted Jun 18, 2013·3 cites·2 claims
- 0766US8147295B2Method of polishing silicon waferKATOH TAKEO·Filed 2009·Granted Apr 3, 2012·4 cites·8 claims
- 0863US8877643B2Method of polishing a silicon waferMATSUDA SHUHEI·Filed 2010·Granted Nov 4, 2014·2 cites·7 claims
- 0963US8759229B2Method for manufacturing epitaxial waferKOYATA SAKAE·Filed 2007·Granted Jun 24, 2014·2 cites·7 claims
- 1061US7648890B2Process for producing silicon waferSUMCO CORP·Filed 2006·Granted Jan 19, 2010·1 cites·7 claims
- 1153US2009117749A1Etching Method of Single WaferSUMCO CORP·Filed 2008·Application pending·0 cites
- 1252US2009297426A1Silicon waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1351US8066896B2Apparatus for etching wafer by single-wafer process and single wafer type method for etching waferKOYATA SAKAE·Filed 2007·Granted Nov 29, 2011·0 cites·4 claims
- 1448US2009294910A1Silicon waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1548US2010021688A1Wafer manufacturing method and wafer obtained through the methodSUMCO CORP·Filed 2009·Application pending·0 cites
- 1648US2009294918A1Semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1747US2009293919A1Method for cleaning semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1847US2007161247A1Etching method of single waferKOYATA SAKAE·Filed 2006·Application pending·0 cites
- 1946US2009297867A1Semiconductor thin film-attached substrate and production method thereofSUMCO CORP·Filed 2009·Application pending·0 cites
- 2045US7955982B2Method for smoothing wafer surface and apparatus used thereforSUMCO CORP·Filed 2007·Granted Jun 7, 2011·0 cites·7 claims
- 2144US10177008B2Silicon wafer and method for manufacturing the sameSUMCO CORP·Filed 2014·Granted Jan 8, 2019·0 cites·8 claims
- 2243US2009042390A1Etchant for silicon wafer surface shape control and method for manufacturing silicon wafers using the sameKOYATA SAKAE·Filed 2007·Application pending·0 cites
- 2341US2009181546A1Single-Wafer Etching Method for Wafer and Etching Apparatus ThereofKATOH TAKEO·Filed 2008·Application pending·0 cites
- 2440US2008214094A1Method for manufacturing silicon waferKATOH TAKEO·Filed 2008·Application pending·0 cites
- 2538US2006246723A1Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry compositionSUMITOMO MITSUBISHI SILICON·Filed 2003·Application pending·0 cites
- 2636US7833908B2Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using the sameSUMCO CORP·Filed 2004·Granted Nov 16, 2010·0 cites·3 claims
- 2733US2006207188A1Ceria abrasive for cmpPAIK UN-GYU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →