Assignee
KOYATA SAKAE
JP·3 granted patents·5 pending applications·5 citations·filing 2004–2007
Top patents by PatentIndex Score
8 records- 0167US8466071B2Method for etching single waferKOYATA SAKAE·Filed 2007·Granted Jun 18, 2013·3 cites·2 claims
- 0263US8759229B2Method for manufacturing epitaxial waferKOYATA SAKAE·Filed 2007·Granted Jun 24, 2014·2 cites·7 claims
- 0351US8066896B2Apparatus for etching wafer by single-wafer process and single wafer type method for etching waferKOYATA SAKAE·Filed 2007·Granted Nov 29, 2011·0 cites·4 claims
- 0447US2007161247A1Etching method of single waferKOYATA SAKAE·Filed 2006·Application pending·0 cites
- 0547US2007184658A1Etching Liquid for Controlling Silicon Wafer Surface ShapeKOYATA SAKAE·Filed 2007·Application pending·0 cites
- 0643US2009042390A1Etchant for silicon wafer surface shape control and method for manufacturing silicon wafers using the sameKOYATA SAKAE·Filed 2007·Application pending·0 cites
- 0737US2007267387A1Processing Method of Silicon WaferKOYATA SAKAE·Filed 2004·Application pending·0 cites
- 0835US2006194441A1Method for etching a silicon wafer and method for performing differentiation between the obverse and the reverse of a silicon wafer using the same methodKOYATA SAKAE·Filed 2005·Application pending·0 cites
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