Inventor · disambiguated record
Eung-Suek Lee
Also filed as: LEE EUNG SUEK
10 granted patents·25 pending applications·11 citations·filing 2006–2016
82Inventor score
Top patents by PatentIndex Score
35 records- 0185US9837343B2Chip embedded substrateSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 5, 2017·5 cites·5 claims
- 0269US8377748B2Method of manufacturing cooling fin and package substrate with cooling finSAMSUNG ELECTRO MECH·Filed 2011·Granted Feb 19, 2013·2 cites·13 claims
- 0360US8633396B2Die mounting substrate and method of fabricating the sameLEE EUNG SUEK·Filed 2010·Granted Jan 21, 2014·2 cites·1 claims
- 0457US7810232B2Method of manufacturing a circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted Oct 12, 2010·1 cites·4 claims
- 0557US7473099B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Jan 6, 2009·1 cites·4 claims
- 0655US8592135B2Method of manufacturing printed circuit boardMOK JEE SOO·Filed 2012·Granted Nov 26, 2013·0 cites·7 claims
- 0755US2009229875A1Printed circuit board having fine pattern and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0854US2010230146A1Circuit layer comprising cnts and method of manufacturing the sameLEE EUNG SUEK·Filed 2009·Application pending·0 cites
- 0954US2009301767A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1053US7973248B2Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 5, 2011·0 cites·7 claims
- 1153US2009064497A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1251US2008121414A1Printed circuit board and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1351US2007059917A1Printed circuit board having fine pattern and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1450US2015373833A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1550US2010288726A1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1650US2009294956A1Cooling fin and package substrate comprising the cooling fin and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1750US2015129289A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1850US2007107934A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1949US8166647B2Method of manufacturing a printed circuit boardHWANG JUN-OH·Filed 2009·Granted May 1, 2012·0 cites·6 claims
- 2049US2014106510A1Die mounting substrate and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2149US2009308650A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2249US2009294739A1Conductive paste including a carbon nanotube and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2348US2009107709A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2448US2009159318A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2548US2009017275A1Heat-releasing printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2647US2009114425A1Conductive paste and printed circuit board using the sameUNIV SUNGKYUNKWAN·Filed 2008·Application pending·0 cites
- 2747US2009083975A1Method of interconnecting layers of a printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2846US2012168205A1Method of manufacturing a printed circuit boardHWANG JUN-OH·Filed 2012·Application pending·0 cites
- 2942US9673066B2Apparatus and method of manufacturing semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 6, 2017·0 cites·10 claims
- 3041US2011073252A1Conductive paste and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 3137US8415200B2Method for manufacturing semiconductor packageHWANG MI SUN·Filed 2011·Granted Apr 9, 2013·0 cites·17 claims
- 3235US2016037619A1Carrier substrate and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3334US2015195902A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3434US2017033039A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 3528US2012103671A1Printed circuit board and method for manufacturing the sameLEE EUNG SUEK·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →