Die mounting substrate and method of fabricating the same

Abstract

In accordance with various embodiments, there is provided a method of fabricating a die mounting substrate, including the steps of preparing a mounting substrate including a pad and a die including a terminal, and printing a conductive paste bump on one of the pad or the terminal. The method further includes the step of connecting the pad and the terminal to each other using the conductive paste bump, thereby surface-mounting the die on the mounting substrate.

What is claimed is: 
     
         1 . A method of fabricating a die mounting substrate, comprising:
 (A) preparing a mounting substrate comprising a pad and a die including a terminal;   (B) printing a conductive paste bump on one of the pad or the terminal; and   (C) connecting the pad and the terminal to each other using the conductive paste bump, thereby surface-mounting the die on the mounting substrate.   
     
     
         2 . The method as set forth in  claim 1 , wherein the conductive paste bump is printed by means of a screen printer using a conductive paste to have a predetermined height through continuous printing. 
     
     
         3 . The method as set forth in  claim 1 , wherein one side of the conductive paste bump comprises a size same as the pad, and the other side of the conductive bump comprises a size same as the terminal. 
     
     
         4 . The method as set forth in  claim 1 , wherein the conductive paste bump comprises a cross-sectional shape of a trapezoid or an inverted trapezoid. 
     
     
         5 . The method as set forth in  claim 1 , wherein the conductive paste bump comprises copper, silver, or carbon nanotubes. 
     
     
         6 . The method as set forth in  claim 1 , further comprising:
 (D) applying an underfill resin between the mounting substrate and the die, after (C).