Method of manufacturing a printed circuit board

Abstract

A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

1 - 6 . (canceled) 
     
     
         7 . A printed circuit board comprising:
 an insulated layer with a groove formed thereon;   a metallic substance formed on an inner side of the groove and on one side of the insulated layer; and   a first circuit pattern formed on at least one of another side of the insulated layer and the metallic substance formed on the groove.   
     
     
         8 . The printed circuit board of  claim 7 , wherein the metallic substance is carbon-nanotube. 
     
     
         9 . The printed circuit board of  claim 7 , further comprising:
 a conductive bump formed on a portion of the first circuit pattern;   an insulating material stacked on the first circuit pattern such that the first circuit pattern is filled by the insulating material and the insulating material is penetrated by the conductive bump; and   a second circuit pattern formed on the insulating material.