Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof

Abstract

Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin.

1 . A cooling fin comprising a fired object containing a carbon component. 
   
   
       2 . The cooling fin according to  claim 1 , wherein the fired object includes carbon nanotubes or carbon nanofibers, and metal microparticles. 
   
   
       3 . A package substrate comprising:
 a printed circuit board on which a semiconductor chip is mounted; and   a cooling fin bonded to the semiconductor chip and comprising a fired object containing a carbon component.   
   
   
       4 . The package substrate according to  claim 3 , wherein the fired object includes carbon nanotubes or carbon nanofibers, and metal microparticles. 
   
   
       5 . The package substrate according to  claim 3 , wherein the cooling fin is configured to have a cover structure so as to protect a surface of the printed circuit board including the semiconductor chip from an external environment in a sealing manner. 
   
   
       6 . A method of manufacturing a cooling fin, comprising:
 preparing a mold, which comprises a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin;   printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin;   removing the support base to leave a cooling object; and   firing the cooling object.   
   
   
       7 . The method according to  claim 6 , wherein preparing the mold comprises:
 forming the resin layer on a side of the support base; and   imprinting the resin layer with a stamp having a pattern corresponding to the groove   removing the stamp.   
   
   
       8 . The method according to  claim 6 , further comprising, after printing the fireable paste, drying the fireable paste which is printed. 
   
   
       9 . The method according to  claim 6 , wherein the fireable paste includes carbon nanotubes or carbon nanofibers, metal microparticles and a binder. 
   
   
       10 . The method according to  claim 9 , wherein firing the cooling object causes the resin layer and the binder to be eliminated. 
   
   
       11 . The method according to  claim 10 , further comprising, after firing the cooling object,
 removing the resin layer and the binder which are not eliminated by the firing, through reactive ion etching (RIE).   
   
   
       12 . A method of manufacturing a package substrate, comprising:
 preparing a mold, which comprises a support base and a resin layer formed on the support base and including on a side thereof a groove configured to form a cooling fin;   printing fireable paste containing a carbon component on a side of the mold including the groove;   removing the support base to leave a cooling object;   firing the cooling object to prepare a cooling fin; and   bonding the cooling fin on a semiconductor chip mounted on a printed circuit board.   
   
   
       13 . The method according to  claim 12 , wherein the preparing the mold comprises:
 placing the resin layer on a side of the support base;   imprinting the resin layer with a stamp having a pattern corresponding to the groove; and   removing the stamp.   
   
   
       14 . The method according to  claim 12 , further comprising, after printing the fireable paste, drying the fireable paste which is printed. 
   
   
       15 . The method according to  claim 12 , wherein the fireable paste includes carbon nanotubes or carbon nanofibers, metal microparticles and a binder. 
   
   
       16 . The method according to  claim 15 , wherein firing the cooling object causes the resin layer and the binder to be eliminated. 
   
   
       17 . The method according to  claim 16 , further comprising, after firing the cooling object,
 removing the resin layer and the binder, which are not eliminated by the firing, through reactive ion etching (RIE).   
   
   
       18 . The method according to  claim 12 , wherein the cooling fin is configured to have a cover structure so as to protect a surface of the printed circuit board including the semiconductor chip from an external environment in a sealing manner.