Inventor · disambiguated record
Huey-Ming Wang
Also filed as: WANG HUEY-MING
20 granted patents·3 pending applications·692 citations·filing 1995–2015
96Inventor score
Files withGLOBALFOUNDRIES INC6MULTI PLANAR TECHNOLOGIES INC6EBARA TECH INC4RODEL INC3MITSUBISHI MATERIALS CORP2
Top patents by PatentIndex Score
23 records- 0196US6558232B1System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted May 6, 2003·92 cites·27 claims
- 0296US6506105B1System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure controlMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted Jan 14, 2003·105 cites·70 claims
- 0396US5693239APolishing slurries comprising two abrasive components and methods for their useRODEL INC·Filed 1995·Granted Dec 2, 1997·133 cites·20 claims
- 0492US6623343B2System and method for CMP head having multi-pressure annular zone subcarrier material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2001·Granted Sep 23, 2003·51 cites·38 claims
- 0591US8877580B1Reduction of oxide recesses for gate height controlGLOBALFOUNDRIES INC·Filed 2013·Granted Nov 4, 2014·13 cites·11 claims
- 0690US6893327B2Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surfaceMULTI PLANAR TECHNOLOGIES INC·Filed 2001·Granted May 17, 2005·42 cites·43 claims
- 0784US6540590B1Chemical mechanical polishing apparatus and method having a rotating retaining ringMULTI PLANAR TECHNOLOGIES INC·Filed 2000·Granted Apr 1, 2003·26 cites·22 claims
- 0882US6966822B2System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlMULTI PLANAR TECHNOLOGIES INC·Filed 2003·Granted Nov 22, 2005·18 cites·13 claims
- 0982US6309290B1Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure controlMITSUBISHI MATERIALS CORP·Filed 1999·Granted Oct 30, 2001·46 cites·28 claims
- 1082US5770103AComposition and method for polishing a composite comprising titaniumRODEL INC·Filed 1997·Granted Jun 23, 1998·66 cites·17 claims
- 1176US7326103B2Vertically adjustable chemical mechanical polishing head and method for use thereofEBARA TECH INC·Filed 2003·Granted Feb 5, 2008·20 cites·24 claims
- 1276US6001269AMethod for polishing a composite comprising an insulator, a metal, and titaniumRODEL INC·Filed 1997·Granted Dec 14, 1999·48 cites·10 claims
- 1370US6916226B2Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereofEBARA TECH INC·Filed 2002·Granted Jul 12, 2005·13 cites·21 claims
- 1461US9093560B2Gate height uniformity in semiconductor devicesGLOBALFOUNDRIES INC·Filed 2013·Granted Jul 28, 2015·1 cites·14 claims
- 1561US7004822B2Chemical mechanical polishing and pad dressing methodEBARA TECH INC·Filed 2003·Granted Feb 28, 2006·9 cites·14 claims
- 1654US6913514B2Chemical mechanical polishing endpoint detection system and methodEBARA TECH INC·Filed 2003·Granted Jul 5, 2005·5 cites·21 claims
- 1753US9257516B2Reduction of oxide recesses for gate height controlGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 9, 2016·0 cites·19 claims
- 1849US9349814B2Gate height uniformity in semiconductor devicesGLOBALFOUNDRIES INC·Filed 2015·Granted May 24, 2016·0 cites·20 claims
- 1947US2006105685A1System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal controlKAJIWARA JIRO·Filed 2005·Application pending·0 cites
- 2045US8927356B1Removal of nitride bump in opening replacement gate structureGLOBALFOUNDRIES INC·Filed 2013·Granted Jan 6, 2015·0 cites·20 claims
- 2144US6641461B2Chemical mechanical polishing apparatus having edge, center and annular zone control of material removalMULTI PLANAR TECHNOLOGYIES INC·Filed 2001·Granted Nov 4, 2003·4 cites·27 claims
- 2242US2015087134A1Semiconductor isolation region uniformityGLOBALFOUNDRIES INC·Filed 2013·Application pending·0 cites
- 2338US2002173242A1Chemical mechanical polishing head assembly having floating wafer carrier and retaining ringMITSUBISHI MATERIALS CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →