Inventor · disambiguated record
Yee Na Shin
Also filed as: SHIN YEE NA
14 granted patents·15 pending applications·40 citations·filing 2007–2024
88Inventor score
Top patents by PatentIndex Score
29 records- 0194US9462697B2Electronic component embedded substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 4, 2016·13 cites·18 claims
- 0291US9307632B2Multilayered substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 5, 2016·14 cites·21 claims
- 0376US9788433B2Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 10, 2017·2 cites·8 claims
- 0476US9420683B2Substrate embedding passive elementSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 16, 2016·4 cites·8 claims
- 0574US9526177B2Printed circuit board including electronic component embedded therein and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 20, 2016·3 cites·10 claims
- 0664US10015884B2Printed circuit board including embedded electronic component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 3, 2018·1 cites·7 claims
- 0761US9313893B2Substrate having electronic component embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 12, 2016·1 cites·22 claims
- 0860US8450844B2Semiconductor package and method of manufacturing the sameSHIN YEE NA·Filed 2010·Granted May 28, 2013·2 cites·8 claims
- 0956US9345141B2Multilayer ceramic capacitor and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 17, 2016·0 cites·28 claims
- 1054US10887995B2Method for manufacturing a printed circuit board including an embedded electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 5, 2021·0 cites·11 claims
- 1152US2025182978A1Tantalum capacitorSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1251US9171780B2Method for manufacturing semiconductor packageSAMSUNG ELECTRO MECH·Filed 2014·Granted Oct 27, 2015·0 cites·10 claims
- 1351US9155199B2Passive device embedded in substrate and substrate with passive device embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 6, 2015·0 cites·10 claims
- 1451US2014182897A1Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1550US2014177192A1Core substrate and method for manufacturing the same, and substrate with built-in electronic components and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1650US2014151104A1Electronic component embedded substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1749US2009277673A1PCB having electronic components embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1848US9504169B2Printed circuit board having embedded electronic device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 22, 2016·0 cites·13 claims
- 1948US9474167B2Multilayered substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 18, 2016·0 cites·15 claims
- 2047US2008158777A1Capacitor and multi-layer board embedding the capacitorSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2145US2015195907A1Multilayered substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2245US2012017435A1Method of manufacturing PCB having electronic components embedded thereinSOHN SEUNG HYUN·Filed 2011·Application pending·0 cites
- 2344US2009057860A1Semiconductor memory packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2444US2014182916A1Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2543US2015027757A1Pcb having glass coreSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2641US2014374870A1Image sensor module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2740US2013027896A1Electronic component embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2840US2015380276A1Method for manufacturing semiconductor packageSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2931US2011164391A1Electronic component-embedded printed circuit board and method of manufacturing the sameSHIN YEE NA·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →