Inventor · disambiguated record
Yao-Hsin Feng
Also filed as: FENG YAO · FENG YAO-HSIN
13 granted patents·9 pending applications·120 citations·filing 1999–2022
90Inventor score
Files withADVANCED SEMICONDUCTOR ENG12C18 LLC2CARBON8WATER INC2REALTEK SEMICONDUCTOR CORP2Baidu online network technology beijing co ltd1
Top patents by PatentIndex Score
22 records- 0186US6483187B1Heat-spread substrateADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Nov 19, 2002·61 cites·18 claims
- 0277US7229846B2Semiconductor package having an optical device and a method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 12, 2007·7 cites·18 claims
- 0369US7115484B2Method of dicing a waferADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 3, 2006·13 cites·13 claims
- 0469US6768332B2Semiconductor wafer and testing method for the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 27, 2004·16 cites·14 claims
- 0565US7122459B2Semiconductor wafer package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 17, 2006·11 cites·9 claims
- 0657USD1030392SSoda makerCARBON8WATER INC·Filed 2022·Granted Jun 11, 2024·2 cites·1 claims
- 0752US11829317B2Cable, controller, and control methodREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Nov 28, 2023·0 cites·15 claims
- 0850US11880678B2Chip having memoryREALTEK SEMICONDUCTOR CORP·Filed 2020·Granted Jan 23, 2024·0 cites·12 claims
- 0947US2023405539A1Control method of carbonated water machine and carbonated water machineC18 LLC·Filed 2022·Application pending·0 cites
- 1047US2007194420A1Semiconductor package having an optical device and a method of making the sameFENG YAO-HSIN·Filed 2007·Application pending·0 cites
- 1146US2006286791A1Semiconductor wafer package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1244US12503351B2Carbonated water machineCARBON8WATER INC·Filed 2022·Granted Dec 23, 2025·0 cites·9 claims
- 1344US11554946B1Supercharger and carbonated water mixing deviceC18 LLC·Filed 2022·Granted Jan 17, 2023·0 cites·8 claims
- 1443US6429049B1Laser method for forming viasADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Aug 6, 2002·3 cites·17 claims
- 1543US2007046314A1Process for testing IC waferADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1641US2020134872A1Automatic calibration method and apparatus for onboard cameraBaidu online network technology beijing co ltd·Filed 2019·Application pending·0 cites
- 1739US2007197233A1Method of location-oriented call screening for communication apparatusINVENTEC APPLIANCES CORP·Filed 2006·Application pending·0 cites
- 1839US2005019965A1Process for testing IC waferADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 1936US2004082103A1Semiconductor package with marking film and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 2033US6172318B1Base for wire bond checkingADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jan 9, 2001·4 cites·5 claims
- 2131US6392424B1Press plate of wire bond checking systemADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted May 21, 2002·3 cites·6 claims
- 2231US2002195721A1Cavity down ball grid array packaging structureFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →