Inventor · disambiguated record
Yasumasa Kasuya
Also filed as: KASUYA YASUMASA
37 granted patents·12 pending applications·256 citations·filing 2001–2024
97Inventor score
Top patents by PatentIndex Score
49 records- 0196US9831161B2Support terminal integral with die pad in semiconductor packageROHM CO LTD·Filed 2016·Granted Nov 28, 2017·10 cites·31 claims
- 0295US10056318B2Support terminal integral with die pad in semiconductor packageROHM CO LTD·Filed 2017·Granted Aug 21, 2018·8 cites·30 claims
- 0395US9780069B2Semiconductor deviceROHM CO LTD·Filed 2015·Granted Oct 3, 2017·13 cites·20 claims
- 0493US10497644B2Semiconductor device with first and second semiconductor chips connected to insulating elementROHM CO LTD·Filed 2018·Granted Dec 3, 2019·5 cites·12 claims
- 0592US11699641B2Semiconductor deviceROHM CO LTD·Filed 2021·Granted Jul 11, 2023·1 cites·18 claims
- 0692US10163850B2Semiconductor deviceROHM CO LTD·Filed 2017·Granted Dec 25, 2018·7 cites·11 claims
- 0792US8022532B2Interposer and semiconductor deviceROHM CO LTD·Filed 2006·Granted Sep 20, 2011·30 cites·22 claims
- 0891US9287202B2Resin-encapsulated semiconductor device and its manufacturing methodROHM CO LTD·Filed 2014·Granted Mar 15, 2016·7 cites·20 claims
- 0990US7608930B2Semiconductor device and method of manufacturing semiconductor deviceROHM CO LTD·Filed 2008·Granted Oct 27, 2009·18 cites·14 claims
- 1090US2025062199A1Semiconductor deviceROHM CO LTD·Filed 2024·Application pending·0 cites
- 1189US11177198B2Plurality of lead frames electrically connected to inductor chipROHM CO LTD·Filed 2019·Granted Nov 16, 2021·3 cites·18 claims
- 1289US10790258B2Electronic device and mounting structure of the sameROHM CO LTD·Filed 2018·Granted Sep 29, 2020·4 cites·40 claims
- 1389US10366948B2Semiconductor device and method for manufacturing the sameROHM CO LTD·Filed 2016·Granted Jul 30, 2019·6 cites·14 claims
- 1486USD824866SSemiconductor deviceROHM CO LTD·Filed 2017·Granted Aug 7, 2018·26 cites·1 claims
- 1585US7825498B2Semiconductor deviceROHM CO LTD·Filed 2007·Granted Nov 2, 2010·13 cites·33 claims
- 1684US8039934B2Resin-encapsulated semiconductor device and its manufacturing methodROHM CO LTD·Filed 2008·Granted Oct 18, 2011·6 cites·6 claims
- 1783US12165960B2Semiconductor deviceROHM CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 1882US9941233B2Electronic device and mounting structure of the sameROHM CO LTD·Filed 2015·Granted Apr 10, 2018·3 cites·75 claims
- 1982US9520374B2Semiconductor device, substrate and semiconductor device manufacturing methodROHM CO LTD·Filed 2014·Granted Dec 13, 2016·4 cites·8 claims
- 2082US8829660B2Resin-encapsulated semiconductor deviceKASUYA YASUMASA·Filed 2011·Granted Sep 9, 2014·4 cites·14 claims
- 2182US8115299B2Semiconductor device, lead frame and method of manufacturing semiconductor deviceKASUYA YASUMASA·Filed 2008·Granted Feb 14, 2012·11 cites·13 claims
- 2282US7095100B2Semiconductor device and method of making the sameROHM CO LTD·Filed 2001·Granted Aug 22, 2006·28 cites·10 claims
- 2380US6936499B2Semiconductor device and fabrication process thereforROHM CO LTD·Filed 2003·Granted Aug 30, 2005·24 cites·6 claims
- 2477US9355988B2Semiconductor deviceROHM CO LTD·Filed 2015·Granted May 31, 2016·2 cites·30 claims
- 2575US6586832B2Semiconductor device and fabrication process thereofROHM CO LTD·Filed 2001·Granted Jul 1, 2003·18 cites·6 claims
- 2670US10679928B2Power module and motor drive circuitROHM CO LTD·Filed 2017·Granted Jun 9, 2020·1 cites·53 claims
- 2766US7192870B2Semiconductor device and fabrication process thereforROHM CO LTD·Filed 2005·Granted Mar 20, 2007·3 cites·10 claims
- 2862US2024258219A1Semiconductor deviceROHM CO LTD·Filed 2024·Application pending·0 cites
- 2962US2024282676A1Semiconductor deviceROHM CO LTD·Filed 2024·Application pending·0 cites
- 3062US2024282678A1Semiconductor deviceROHM CO LTD·Filed 2024·Application pending·0 cites
- 3161US8350371B2Semiconductor device and method of manufacturing semiconductor deviceROHM CO LTD·Filed 2010·Granted Jan 8, 2013·1 cites·24 claims
- 3259US10832996B2Power module and motor drive circuitROHM CO LTD·Filed 2020·Granted Nov 10, 2020·0 cites·19 claims
- 3359US9991213B2Resin-encapsulated semiconductor device and its manufacturing methodROHM CO LTD·Filed 2016·Granted Jun 5, 2018·0 cites·9 claims
- 3458US10192845B2Electronic device and mounting structure of the sameROHM CO LTD·Filed 2018·Granted Jan 29, 2019·0 cites·26 claims
- 3558US9502339B2Resin-encapsulated semiconductor device and its manufacturing methodROHM CO LTD·Filed 2016·Granted Nov 22, 2016·0 cites·18 claims
- 3656US9899300B2Semiconductor deviceROHM CO LTD·Filed 2017·Granted Feb 20, 2018·0 cites·27 claims
- 3754US9640455B2Semiconductor deviceROHM CO LTD·Filed 2016·Granted May 2, 2017·0 cites·35 claims
- 3851US2008169538A1Semiconductor DeviceROHM CO LTD·Filed 2008·Application pending·0 cites
- 3951US2011156226A1Interposer and semiconductor deviceROHM CO LTD·Filed 2011·Application pending·0 cites
- 4050US8810016B2Semiconductor device, substrate and semiconductor device manufacturing methodKASUYA YASUMASA·Filed 2011·Granted Aug 19, 2014·0 cites·8 claims
- 4150US8368234B2Semiconductor device, production method for the same, and substrateROHM CO LTD·Filed 2011·Granted Feb 5, 2013·0 cites·6 claims
- 4250US7902681B2Semiconductor device, production method for the same, and substrateROHM CO LTD·Filed 2006·Granted Mar 8, 2011·0 cites·4 claims
- 4349US2009051049A1Semiconductor device, substrate and semiconductor device manufacturing methodROHM CO LTD·Filed 2006·Application pending·0 cites
- 4447US2006118940A1Semiconductor device and method of fabricating the sameROHM CO LTD·Filed 2006·Application pending·0 cites
- 4547US2006175717A1Semiconductor device and method of making the sameROHM CO LTD·Filed 2006·Application pending·0 cites
- 4642US2005073039A1Semiconductor device and method of fabricating the sameROHM CO LTD·Filed 2004·Application pending·0 cites
- 4741US12027450B2Electronic device and electronic device mounting structureROHM CO LTD·Filed 2020·Granted Jul 2, 2024·0 cites·20 claims
- 4839US2009289342A1Semiconductor Device and Semiconductor Device Manufacturing MethodROHM CO LTD·Filed 2006·Application pending·0 cites
- 4934US2012153444A1Semiconductor deviceHAGA MOTOHARU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →