Assignee
KASUYA YASUMASA
JP·3 granted patents·15 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0182US8829660B2Resin-encapsulated semiconductor deviceKASUYA YASUMASA·Filed 2011·Granted Sep 9, 2014·4 cites·14 claims
- 0282US8115299B2Semiconductor device, lead frame and method of manufacturing semiconductor deviceKASUYA YASUMASA·Filed 2008·Granted Feb 14, 2012·11 cites·13 claims
- 0350US8810016B2Semiconductor device, substrate and semiconductor device manufacturing methodKASUYA YASUMASA·Filed 2011·Granted Aug 19, 2014·0 cites·8 claims
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