Inventor · disambiguated record
Buu Q. Diep
Also filed as: DIEP BUU · DIEP BUU Q · DIEP BUU QUOC
35 granted patents·6 pending applications·79 citations·filing 2006–2024
96Inventor score
Top patents by PatentIndex Score
41 records- 0189US8736045B1Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2012·Granted May 27, 2014·8 cites·6 claims
- 0288US8257985B2MEMS device and fabrication methodSTEVENSON CLAYTON LEE·Filed 2008·Granted Sep 4, 2012·21 cites·9 claims
- 0385US8809784B2Incident radiation detector packagingGOOCH ROLAND W·Filed 2011·Granted Aug 19, 2014·11 cites·20 claims
- 0483US11990885B2Method for manufacturing acoustic devices with improved performanceQORVO US INC·Filed 2021·Granted May 21, 2024·1 cites·20 claims
- 0582US9093444B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2013·Granted Jul 28, 2015·4 cites·6 claims
- 0682US8454789B2Disposable bond gap control structuresDIEP BUU·Filed 2011·Granted Jun 4, 2013·6 cites·2 claims
- 0780US12388407B2Method for manufacturing acoustic devices with improved performanceQORVO US INC·Filed 2024·Granted Aug 12, 2025·0 cites·15 claims
- 0878US9427776B2Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arraysRAYTHEON CO·Filed 2012·Granted Aug 30, 2016·1 cites·11 claims
- 0976US8844793B2Reducing formation of oxide on solderDIEP BUU·Filed 2011·Granted Sep 30, 2014·4 cites·20 claims
- 1075US10367470B2Wafer-level-packaged BAW devices with surface mount connection structuresQORVO US INC·Filed 2017·Granted Jul 30, 2019·2 cites·35 claims
- 1175US9969610B2Wafer level MEMS package including dual seal ringRAYTHEON CO·Filed 2017·Granted May 15, 2018·1 cites·12 claims
- 1275US7378293B2MEMS fabrication methodTEXAS INSTRUMENTS INC·Filed 2006·Granted May 27, 2008·5 cites·24 claims
- 1373US10659000B2Fluidic sensor device having UV-blocking coverQORVO US INC·Filed 2017·Granted May 19, 2020·2 cites·12 claims
- 1473US9334154B2Hermetically sealed package having stress reducing layerRAYTHEON CO·Filed 2014·Granted May 10, 2016·2 cites·22 claims
- 1571US9132496B2Reducing formation of oxide on solderRAYTHEON CO·Filed 2014·Granted Sep 15, 2015·2 cites·20 claims
- 1670US9227839B2Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave couplingRAYTHEON CO·Filed 2014·Granted Jan 5, 2016·2 cites·14 claims
- 1768US8980676B2Fabrication of window cavity cap structures in wafer level packagingDIEP BUU·Filed 2012·Granted Mar 17, 2015·2 cites·16 claims
- 1866US9073298B2Disposable bond gap control structuresRAYTHEON CO·Filed 2013·Granted Jul 7, 2015·0 cites·12 claims
- 1966US9022584B2Protecting an optical surfaceBLACK STEPHEN H·Filed 2011·Granted May 5, 2015·2 cites·20 claims
- 2065US8393526B2System and method for packaging electronic devicesDIEP BUU·Filed 2011·Granted Mar 12, 2013·2 cites·6 claims
- 2164US8343805B1Mems device and fabrication methodTEXAS INSTRUMENTS INC·Filed 2012·Granted Jan 1, 2013·1 cites·19 claims
- 2261US12031949B2Preventing epoxy bleed-out for biosensor devicesQORVO US INC·Filed 2020·Granted Jul 9, 2024·0 cites·20 claims
- 2359US10262913B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2018·Granted Apr 16, 2019·0 cites·8 claims
- 2458US9174836B2Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2014·Granted Nov 3, 2015·0 cites·23 claims
- 2557US9187312B2Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2014·Granted Nov 17, 2015·0 cites·15 claims
- 2656US10315918B2Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arraysRAYTHEON CO·Filed 2016·Granted Jun 11, 2019·0 cites·18 claims
- 2756US9966320B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2016·Granted May 8, 2018·0 cites·5 claims
- 2856US9196556B2Getter structure and method for forming such structureRAYTHEON CO·Filed 2014·Granted Nov 24, 2015·0 cites·6 claims
- 2953US9520332B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2015·Granted Dec 13, 2016·0 cites·4 claims
- 3052US9708181B2Hermetically sealed package having stress reducing layerRAYTHEON CO·Filed 2016·Granted Jul 18, 2017·0 cites·4 claims
- 3152US8530984B2Semiconductor device structures and their fabricationTEXAS INSTRUMENTS INC·Filed 2012·Granted Sep 10, 2013·0 cites·8 claims
- 3251US2023378928A1Assemblies Including an Acoustic Resonator Device and Methods of FormingQORVO BIOTECHNOLOGIES LLC·Filed 2021·Application pending·0 cites
- 3350US9771258B2Wafer level MEMS package including dual seal ringRAYTHEON CO·Filed 2015·Granted Sep 26, 2017·0 cites·4 claims
- 3449US2024353376A1Detection of sensor passivation failureQORVO US INC·Filed 2021·Application pending·0 cites
- 3546US9105800B2Method of forming deposited patterns on a surfaceRAYTHEON CO·Filed 2013·Granted Aug 11, 2015·0 cites·3 claims
- 3646US2023389430A1Methods for depositing piezoelectric materials, and materials deposited therewithQORVO BIOTECHNOLOGIES LLC·Filed 2021·Application pending·0 cites
- 3746US2016040282A1Getter structure and method for forming such structureRAYTHEON CO·Filed 2015·Application pending·0 cites
- 3844US10574210B2BAW devices having top electrode leads with reduced reflectanceQORVO US INC·Filed 2017·Granted Feb 25, 2020·0 cites·26 claims
- 3943US2008032484A1Substrate bonding process with integrated ventsTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 4042US2014175590A1Getter structure for wafer level vacuum packaged deviceRAYTHEON CO·Filed 2012·Application pending·0 cites
- 4136US10931257B2WLP BAW device with through-WLP viasQORVO US INC·Filed 2018·Granted Feb 23, 2021·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →