Assignee
DIEP BUU
US·4 granted patents·14 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0182US8454789B2Disposable bond gap control structuresDIEP BUU·Filed 2011·Granted Jun 4, 2013·6 cites·2 claims
- 0276US8844793B2Reducing formation of oxide on solderDIEP BUU·Filed 2011·Granted Sep 30, 2014·4 cites·20 claims
- 0368US8980676B2Fabrication of window cavity cap structures in wafer level packagingDIEP BUU·Filed 2012·Granted Mar 17, 2015·2 cites·16 claims
- 0465US8393526B2System and method for packaging electronic devicesDIEP BUU·Filed 2011·Granted Mar 12, 2013·2 cites·6 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →