Inventor · disambiguated record
Daniel J. Gramarossa
Also filed as: GRAMAROSSA DANIEL J · GRAMAROSSA DANIEL JAMES
8 granted patents·8 pending applications·283 citations·filing 1986–2008
90Inventor score
Top patents by PatentIndex Score
16 records- 0193US6197182B1Apparatus and method for plating wafers, substrates and other articlesTECHNIC·Filed 1999·Granted Mar 6, 2001·110 cites·28 claims
- 0283US6524463B2Method of processing wafers and other planar articles within a processing cellTECHNIC·Filed 2001·Granted Feb 25, 2003·30 cites·17 claims
- 0383US6296753B1Apparatus and method for plating wafers, substrates and other articlesTECHNIC·Filed 2000·Granted Oct 2, 2001·17 cites·19 claims
- 0482US4775046ATransport belt for production partsFUTURE AUTOMATION INC·Filed 1986·Granted Oct 4, 1988·87 cites·16 claims
- 0568US6558750B2Method of processing and plating planar articlesTECHNIC·Filed 2001·Granted May 6, 2003·12 cites·26 claims
- 0668US2009090633A1Electroplating system with movable support structure providing cathode potentialTECHNIC·Filed 2008·Application pending·0 cites
- 0768US2009090632A1Electroplating system including interchangeable carriers for supporting and providing cathode potential to articlesTECHNIC·Filed 2008·Application pending·0 cites
- 0859US2006219562A1System and method of transporting and providing a cathode contact to articles in an electroplating systemGRAMAROSSA DANIEL J·Filed 2005·Application pending·0 cites
- 0958US5186797AMethod and system for removing resin bleed from electronic componentsFUTURE AUTOMATION INC·Filed 1991·Granted Feb 16, 1993·14 cites·6 claims
- 1055US6287443B1Apparatus and method for electroplating wafers, substrates and other articlesTECHNIC·Filed 2000·Granted Sep 11, 2001·2 cites·17 claims
- 1146US4906345AApparatus for carrying encapsulated electronic components through electroplating tanks and surface treatment stationsFUTURE AUTOMATION INC·Filed 1988·Granted Mar 6, 1990·11 cites·9 claims
- 1241US2006219563A1System and method of controlling the demarcation line formed on partially electroplated articlesSEPP WILLIAM F·Filed 2005·Application pending·0 cites
- 1335US2003013285A1Method of processing and plating wafers and other planar articlesFiled 2001·Application pending·0 cites
- 1435US2003010626A1System for plating planar articlesFiled 2001·Application pending·0 cites
- 1535US2003010625A1Processing cells for wafers and other planar articlesFiled 2001·Application pending·0 cites
- 1635US2003010449A1Automatic wafer processing and plating systemFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →