System and method of controlling the demarcation line formed on partially electroplated articles

Abstract

A processing system, electroplating cell, and method of reducing the ration (i.e., demarcation line) that often forms on articles undergoing a partial plating process. The processing system may include a loading station, pre-processing station, electroplating station, post-processing station, unloading station, and a transport system that transports the articles to the various stations. The electroplating cell comprises a container to support a plating fluid bath, an anode electrode, a support structure, which may be part of the transport system, to support the articles such that only a portion thereof is immersed in the plating fluid bath and an air flow system adapted to cause air flow proximate the interface of the articles to the plating fluid bath. The air flow near the articles prevents or reduces plating fluid vapors from impinging the articles, thereby reducing the discoloration that would otherwise form on the articles.

1 . An electroplating system, comprising: 
 a container adapted to support a plating fluid bath;    an anode electrode positioned within said container and adapted to make contact with said plating fluid bath;    a support structure adapted to support an article in a manner that only a portion of said article is immersed in said plating fluid bath; and    a gas flow system adapted to cause gas flow proximate an interface of said article to said plating fluid bath.    
   
   
       2 . The electroplating system of  claim 1 , wherein said gas flow system is adapted to direct gas flow towards said interface of said article to said plating fluid bath.  
   
   
       3 . The electroplating system of  claim 1 , wherein said gas flow system is adapted to direct gas flow away from said interface of said article to said plating fluid bath.  
   
   
       4 . The electroplating system of  claim 1 , wherein said gas flow system comprises: 
 a pipe fluidly coupled to a pressurized gas source; and    a nozzle fluidly coupled to said pipe.    
   
   
       5 . The electroplating system of  claim 1 , wherein said gas comprises any one or more of the following air, nitrogen gas, and/or argon gas.  
   
   
       6 . A method of electroplating an article, comprising: 
 forming a plating fluid bath;    immersing only a portion of an article in said plating fluid bath;    generating a plating current through said plating fluid bath and said article;    producing gas flow proximate an interface of said article to said plating fluid bath while said plating current is flowing through said plating fluid bath and said article.    
   
   
       7 . The method of  claim 6 , wherein said gas flow is directed towards said interface of said article to said plating fluid bath.  
   
   
       8 . The method of  claim 6 , wherein said gas flow is directed away from said interface of said article to said plating fluid bath.  
   
   
       9 . The method of  claim 6 , wherein said gas comprises any one or more of the following air, nitrogen gas, and/or argon gas.  
   
   
       10 . An electroplating system, comprising: 
 a pre-processing station including one or more pre-processing cells;    an electroplating station including one or more electroplating cells;    a post-processing station including one or more post-processing cells; and    a transport system adapted to transport articles horizontally through said pre-processing station, said electroplating station, and said post-processing station;    wherein at least one of said electroplating cell comprises: 
 a container adapted to support a plating fluid bath;  
 an anode electrode positioned within said container and adapted to make contact with said plating fluid bath;  
 wherein said transport system is adapted to support said articles in a manner that only selected portions of said articles are immersed in said plating fluid bath; and  
 a gas flow system adapted to cause gas flow proximate respective interfaces of said articles to said plating fluid bath.  
   
   
   
       11 . The electroplating system of  claim 10 , wherein said gas flow system is adapted to direct gas flow towards said respective interfaces of said articles to said plating fluid bath.  
   
   
       12 . The electroplating system of  claim 10 , wherein said gas flow system is adapted to direct gas flow away from said respective interfaces of said articles to said plating fluid bath.  
   
   
       13 . The electroplating system of  claim 10 , wherein said gas flow system comprises: 
 a pipe fluidly coupled to a pressurized gas source; and    a nozzle fluidly coupled to said pipe.    
   
   
       14 . The electroplating system of  claim 10 , wherein said gas comprises any one or more of the following air, nitrogen gas, and/or argon gas.