System and method of transporting and providing a cathode contact to articles in an electroplating system

Abstract

A processing system, electroplating cell, transport system, cathode contact subsystem and method of providing a cathode contact to the articles being transported within an electroplating cell. The processing system may include a loading station, pre-processing station, electroplating station, post-processing station, unloading station, and a transport system that transports the articles to the various stations. The electroplating cell comprises a container to support a plating fluid bath, and an anode electrode. In one embodiment, the cathode contact system provides a cathode contact to the articles by way of the transport system's electrically-conductive, conveyor structure. In another embodiment, the cathode contact system comprises an electrically-conductive moving conveyor structure adapted to make cathode contact to said articles and move substantially in synchronous with the articles. In yet another embodiment, the transport system comprises a plurality of multi-article carriers supported by a conveyor structure, and adapted to provide a cathode contact to the articles.

1 . An electroplating system, comprising: 
 an electroplating cell including a container to support a plating fluid bath and an anode electrode situated within said container;    a transport system adapted to transport articles through said plating fluid bath, wherein said transport system comprises an electrically conductive, movable support structure to support said articles; and    a cathode contact system adapted to provide a cathode potential to said articles by way of said electrically conductive, movable support structure.    
   
   
       2 . The electroplating system of  claim 1 , wherein said cathode contact system comprises a contact member adapted to slide against said electrically-conductive, movable support structure.  
   
   
       3 . The electroplating system of  claim 1 , wherein said cathode contact system comprises a contact member that is rotationally coupled to said electrically-conductive, movable support structure.  
   
   
       4 . The electroplating system of  claim 3 , wherein said contact member comprises a first electrically-conductive wheel rotationally coupled to said electrically-conductive, movable support structure; and wherein said cathode contact system further comprises: 
 a second electrically-conductive wheel rotationally coupled to said first electrically-conductive wheel; and    a brush in electrical contact with said second electrically-conductive wheel, wherein said brush is electrically coupled to a source of said cathode potential.    
   
   
       5 . The electroplating system of  claim 1 , wherein said electrically-conductive, movable support structure comprises a belt, a chain, or a cable.  
   
   
       6 . The electroplating system of  claim 1 , further comprising a movable preload mechanism to apply a continuous force to the articles against the electrically conductive, movable support structure to ensure a positive cathode contact to said articles.  
   
   
       7 . The electroplating system of  claim 1 , further comprising a plurality of insert-carriers supported on said electrically-conductive, movable support structure, wherein said insert-carriers are adapted to respectively support said articles.  
   
   
       8 . The electroplating system of  claim 1 , further comprising: 
 a loading station adapted to load said articles onto said electrically-conductive, movable support structure;    one or more pre-processing cells configured to perform one or more pre-processes on said articles prior to the articles undergoing one or more electroplating processes;    one or more post-processing cells configured to perform one or more post-processes on said articles after the articles have undergone the one or more electroplating processes; and    an unloading station adapted to unload said articles from said electrically-conductive, movable support structure.    
   
   
       9 . A method of electroplating articles, comprising: 
 transporting said one or more articles into an electroplating cell by an electrically conductive, movable support structure, wherein said articles make contact with a plating fluid bath formed within said electroplating cell;    providing a cathode potential to said articles by way of said electrically conductive, movable support structure; and    energizing an anode electrode situated within said plating fluid bath to form a plating current through said articles.    
   
   
       10 . An electroplating system, comprising: 
 an electroplating cell including a container to support a plating fluid bath and an anode electrode situated within said container;    a transport system adapted to transport articles through said plating fluid bath; and    a cathode contact system comprising an electrically-conductive moving structure adapted to make electrical contact with said articles and to move substantially in synchronous with said articles.    
   
   
       11 . The electroplating system of  claim 10 , wherein said transport system comprises: 
 a first conveyor structure adapted to support thereon said articles, wherein said first conveyor structure is supported around a first pair of wheels; and    a first drive motor for rotating the conveyor structure.    
   
   
       12 . The electroplating system of  claim 11 , wherein said first conveyor structure comprises a belt, chain or cable.  
   
   
       13 . The electroplating system of  claim 11 , wherein said cathode contact system comprises an electrically-conductive second conveyor structure adapted to make electrical contact with said articles and route a cathode potential thereto.  
   
   
       14 . The electroplating system of  claim 13 , wherein said second conveyor structure is further adapted to apply positive pressure against said articles to further secure said articles onto said first conveyor structure.  
   
   
       15 . The electroplating system of  claim 13 , wherein said second conveyor structure comprises a conductive rubber, a metal band, or a conductive spring.  
   
   
       16 . The electroplating system of  claim 13 , wherein said second conveyor structure comprises a plurality of electrically-conductive, spring-loaded fingers adapted to a make electrical contact with respective articles.  
   
   
       17 . The electroplating system of  claim 13 , further comprising a contact member adapted to make contact with said second conveyor structure to provide a cathode potential thereto.  
   
   
       18 . The electroplating system of  claim 17 , wherein said contact member is adapted to slide against or roll with said second conveyor structure.  
   
   
       19 . The electroplating system of  claim 13 , wherein said second conveyor structure is rotatably coupled to said first driver motor.  
   
   
       20 . The electroplating system of  claim 13 , further comprising a second drive motor for rotating said second conveyor structure.  
   
   
       21 . The electroplating system of  claim 20 , further comprising a synchronization system to synchronize the speed of said second conveyor structure with said first conveyor structure, wherein said synchronization system comprises: 
 a speed sensing device adapted to generate a speed signal indicative of a speed of said first driver motor; and    a controller to generate a speed control signal for said second drive motor in response to said speed signal.    
   
   
       22 . The electroplating system of  claim 11 , wherein said transport system comprises a plurality of insert-carriers supported on said first conveyor structure, wherein said insert-carriers are adapted to respectively support said articles.  
   
   
       23 . The electroplating system of  claim 10 , further comprising: 
 a loading station adapted to load said articles onto said transport system;    one or more pre-processing cells configured to perform one or more pre-processes on said articles prior to the articles undergoing one or more electroplating processes;    one or more post-processing cells configured to perform one or more post-processes on said articles after the articles have undergone the one or more electroplating processes; and    an unloading station adapted to unload said articles from said transport system.    
   
   
       24 . A method of electroplating articles, comprising: 
 transporting said articles into an electroplating cell by a transport system, wherein said articles make contact with a plating fluid bath formed within said electroplating cell;    providing a cathode contact to said articles with an electrically-conductive structure that moves substantially in synchronous with said articles; and    energizing an anode electrode situated within said plating fluid bath to form a plating current through said articles.    
   
   
       25 . An electroplating system, comprising: 
 an electroplating cell including a container to support a plating fluid bath and an anode electrode situated within said container;    a transport system adapted to transport articles through said plating fluid bath, wherein said transport system comprises a plurality of carriers supported by a conveyor structure, and wherein said carriers are each adapted to support at least one of said articles, and further wherein said carriers are each adapted to provide a cathode contact to said at least one of said articles.    
   
   
       26 . The electroplating system of  claim 25 , wherein each of said carriers are adapted to support and provide a cathode contact to a plurality of articles.  
   
   
       27 . The electroplating system of  claim 26 , wherein said plurality of articles are arranged in a single row within said carrier.  
   
   
       28 . The electroplating system of  claim 26 , wherein said plurality of articles are arranged in a plurality of rows to form an array of articles.  
   
   
       29 . The electroplating system of  claim 26 , wherein each of said carriers comprises a base and a cover hinged upon said base, wherein said base is disposed on said conveyor structure, and further wherein said base is adapted to support said articles.  
   
   
       30 . The electroplating system of  claim 29 , wherein said base comprises a plurality of holes that register with corresponding holes of said conveyor structure, and further wherein said registered holes of said base and conveyor structure are adapted to receive said respective articles.  
   
   
       31 . The electroplating system of  claim 29 , wherein said cover and said base are configured such that said base is adapted to receive said articles when said cover is in a first position, and said cover is adapted to provide a cathode contact to said articles when said cover is in a second position different than said first position.  
   
   
       32 . The electroplating system of  claim 31 , wherein said cover comprises a plurality of spring-loaded fingers arranged to make electrical contact with respective articles when said cover is in said second position.  
   
   
       33 . The electroplating system of  claim 29 , wherein said cover comprises a cathode contact port to receive a cathode potential.  
   
   
       34 . The electroplating system of  claim 25 , wherein said conveyor structure comprises an endless metallic or non-metallic band.  
   
   
       35 . The electroplating system of  claim 25 , wherein said conveyor structure comprises a chain or cable.  
   
   
       36 . The electroplating system of  claim 25 , further comprising: 
 a loading station adapted to load said at least one of said articles onto said respective carriers;    one or more pre-processing cells configured to perform one or more pre-processes on said articles prior to the articles undergoing one or more electroplating processes;    one or more post-processing cells configured to perform one or more post-processes on said articles after the articles have undergone the one or more electroplating processes; and    an unloading station adapted to unload said at least one of said articles from said respective carriers.    
   
   
       37 . A method of electroplating articles, comprising: 
 placing a plurality of articles onto a base of carrier with a cover in a first position;    moving said cover of said carrier from said first position to a second position whereat said cover provides a cathode contact to said articles;    transporting said carrier into an electroplating cell, wherein said articles make contact with a plating fluid bath formed within said electroplating cell; and    energizing an anode electrode situated within said plating fluid bath to form a plating current through said articles.