Inventor · disambiguated record
Hye-Jin Cho
Also filed as: CHO HYE JIN
24 granted patents·21 pending applications·310 citations·filing 2004–2017
96Inventor score
Top patents by PatentIndex Score
45 records- 0197US7332386B2Methods of fabricating fin field transistorsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 19, 2008·56 cites·16 claims
- 0297US7265418B2Semiconductor devices having field effect transistorsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 4, 2007·70 cites·7 claims
- 0392US7655161B2Conductive ink composition for inkjet printingSAMSUNG ELECTRO MECH·Filed 2007·Granted Feb 2, 2010·13 cites·7 claims
- 0492US7591872B1Method for producing silver nanoparticles and conductive inkSAMSUNG ELECTRO MECH·Filed 2006·Granted Sep 22, 2009·13 cites·11 claims
- 0587US7227220B2Semiconductor devices having buried bit lines and methods of manufacturing semiconductor devices having buried bit linesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 5, 2007·11 cites·17 claims
- 0686US7804137B2Field effect transistor (FET) devices and methods of manufacturing FET devicesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 28, 2010·12 cites·16 claims
- 0785US7473963B2Metal oxide semiconductor (MOS) transistors having three dimensional channelsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 6, 2009·8 cites·16 claims
- 0885US7329581B2Field effect transistor (FET) devices and methods of manufacturing FET devicesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 12, 2008·12 cites·36 claims
- 0985US7285466B2Methods of forming metal oxide semiconductor (MOS) transistors having three dimensional channelsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 23, 2007·28 cites·31 claims
- 1084US7915138B2Methods of manufacturing non-volatile memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·7 cites·17 claims
- 1184US7897463B2Methods of fabricating vertical twin-channel transistorsSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Mar 1, 2011·6 cites·14 claims
- 1282US7713862B2Printed wiring board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted May 11, 2010·8 cites·14 claims
- 1378US7122431B2Methods of fabrication metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regionsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 17, 2006·20 cites·18 claims
- 1477US7939408B2Non-volatile memory device for 2-bit operation and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted May 10, 2011·4 cites·15 claims
- 1577US7602010B2Multi-bit multi-level non-volatile memory device and methods of operating and fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 13, 2009·7 cites·13 claims
- 1676US8546865B2Nonvolatile memory device having stacked semiconductor layers and common source line adjacent to bit line plugLIM JONG-HO·Filed 2011·Granted Oct 1, 2013·5 cites·12 claims
- 1775US7768070B2Semiconductor devices having field effect transistorsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 3, 2010·5 cites·12 claims
- 1873US7675105B2Non-volatile memory device for 2-bit operation and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 9, 2010·4 cites·9 claims
- 1972US7541645B2Metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regionsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 2, 2009·4 cites·9 claims
- 2071US7875921B2Non-volatile memory device for 2-bit operation and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 25, 2011·2 cites·19 claims
- 2171US7129541B2Field effect transistors including vertically oriented gate electrodes extending inside vertically protruding portions of a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 31, 2006·13 cites·18 claims
- 2267US7968449B2Method for manufacturing printed wiring boardSAMSUNG ELECTRO MECH·Filed 2010·Granted Jun 28, 2011·1 cites·10 claims
- 2359US7955884B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 7, 2011·1 cites·10 claims
- 2459US2011117694A1Solar cell having spherical surface and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 2557US2009151781A1Solar cell having spherical surface and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2656US8030698B2Nonvolatile memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 4, 2011·0 cites·20 claims
- 2750US2015163924A1Method of bonding electronic components and electronic device using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2849US2008081411A1Methods of Manufacturing Non-Volatile Memory DevicesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2949US2009286004A1Method of forming printed circuit pattern, forming guide for pattern, and guide-forming inkSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3049US2007190725A1Methods of Manufacturing Semiconductor devices Having Buried Bit LinesKIM TAE-YONG·Filed 2007·Application pending·0 cites
- 3148US2007283848A1Metal ink composition for inkjet printingSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3247US2008029811A1Vertical Twin-Channel Transistors and Methods of Fabricating the SameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3347US2007275259A1Method of producing metal nanoparticles and metal nanoparticles produced therebySAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3447US2014041206A1Method for repairing via of circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3546US2007056402A1Metal nanoparticles and method for manufacturing thereofSAMSUNG ELECTRO MACHANICS CO L·Filed 2006·Application pending·0 cites
- 3646US2007018140A1Metal nanoparticles and method for producing the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3746US2008081125A1Method for manufacturing cover lay of printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3846US2006254387A1Metal nano particle and method for manufacturing them and conductive inkSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3946US2012171366A1Method for forming wiring and electrode using metal nano pasteJANG SEON HEE·Filed 2011·Application pending·0 cites
- 4043US2006208230A1Method for manufacturing printed circuit board using Ag-Pd alloy nanoparticlesCHO HYE-JIN·Filed 2006·Application pending·0 cites
- 4143US2014106278A1Dry film resist sheet and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4241US2014178814A1Dry film photoresist having oxygen permeable barrier layer and manufacturing method thereofLTD SAMSUNG ELECTRO MECHANICS CO·Filed 2013·Application pending·0 cites
- 4341US2014131081A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4440US2018294270A1Vertical stack memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 4536US2005077553A1Methods of forming multi fin FETs using sacrificial fins and devices so formedFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →