Method for forming wiring and electrode using metal nano paste
Abstract
Disclosed herein is a method for forming a metal wiring and an electrode using a metal nano paste, including a sintering process, wherein the sintering includes: placing a substrate on which a metal nano paste is printed in a furnace and raising a temperature of the furnace to 220 to 240° C. under a nitrogen atmosphere; heating the substrate under a mixed atmosphere of carboxylic acid and air while the temperature of the furnace is maintained at the temperature range; dropping the temperature of the furnace to 100 to 150° C. under the mixed atmosphere of carboxylic acid and air; and dropping the temperature of the furnace to room temperature under a nitrogen atmosphere. According to the present invention, a metal film having high density and a minimized amount of residual metal particles can be formed despite a low-temperature sintering process, like a case where a high-temperature sintering process is employed.
Claims
exact text as granted — not AI-modified1 . A method for forming a metal wiring or an electrode, comprising a sintering process, wherein the sintering includes:
placing a substrate on which a metal nano paste is printed in a furnace and raising a temperature of the furnace to 220 to 240□ under a nitrogen atmosphere; heating the substrate under a mixed atmosphere of carboxylic acid and air while the temperature of the furnace is maintained at the temperature range; dropping the temperature of the furnace to 100 to 150□ under the mixed atmosphere of carboxylic acid and air; and dropping the temperature of the furnace to room temperature under a nitrogen atmosphere.
2 . The method according to claim 1 , wherein the mixed atmosphere consists of 40 to 60 vol % of carboxylic acid and 60 to 40 vol % of air.
3 . The method according to claim 1 , wherein the nitrogen atmosphere consists of a forming gas containing hydrogen gas of below 10 vol % and the balance nitrogen gas.
4 . The method according to claim 1 , wherein the metal nano paste contains at least one metal selected from the group consisting of silver (Ag), copper (Cu), nickel (Ni), gold (Au), platinum (Pt), palladium (Pd), lead (Pb), indium (In), rhodium (Rh), ruthenium (Rd), iridium (Ir), osmium (Os), tungsten (W), tantalum (Ta), bismuth (Bi), tin (Sn), zinc (Zn), titanium (Ti), aluminum (Al), cobalt (Co) and iron (Fe).
5 . The method according to claim 1 , wherein the carboxylic acid is formic acid, acetic acid, or propionic acid.Join the waitlist — get patent alerts
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